Insulectro to Distribute Indubond Lamination Presses from Chemplate Materials SL
February 15, 2021 | InsulectroEstimated reading time: 3 minutes

Insulectro, the largest distributor of materials for use in manufacture of printed circuit board and printed electronics, has announced it will distribute InduBond® lamination presses and supplies manufactured by Chemplate Materials SL of Barcelona, Spain.
“Today we are announcing Insulectro will begin distributing the complete InduBond® equipment product line in North America beginning today,” Insulectro Vice President of Sales and Product Management Ken Parent commented, “This is an exciting opportunity for us to bring these world-class presses to our customers – in particular the X-PRESS 360 lamination press which is Chemplate’s flagship offering. It is one more example of Insulectro’s laser focus on supplying our customers with the best product offerings – materials and equipment - available.”
InduBond® has long been respected for tight accuracy in registration, its lamination presses, automation (automatic loading/unloading), and its eco-friendly best practices.
InduBond® X-PRESS lamination presses utilize a different way of producing the heat required for lamination using standard pressing methods. The innovation of this technology is that it produces heat on the laminated material, and only the laminated material, of each layer of the press pack at the same time, at the same temperature level, without any thermal conduction.
That feature means the press pack heating is perfectly uniform in all directions. Consequently, all the layers of the laminates inside the press have the same temperature profile at the same time. With our induction technology, heating speed is increased, and high temperatures can be reached. Insulectro will also stock replacement parts and consumables for InduBond® equipment.
“Chemplate Materials SL looks forward to this new association with Insulectro in North America,” stated Victor Lazaro Gallego, Technical Director and InduBond® inventor at Chemplate Materials, S.L. “We find Insulectro’s innovative approach to sales and service to be a perfect match for our company’s values and products. The goal of our current strategy is the global market as a key element in the company`s growth. And that is why we want to keep innovating and providing the industry with new technologies that set us apart from our competitors and increase the knowledge and acceptance of the InduBond® commercial brand internationally.”
Chemplate Materials SL was established in 1986 in the electroplating business. Nowadays is a company focused on manufacturing equipment for registering PCB multilayers with an innovative process, covering the registry and the press process. They have developed a technology with a big growth potential and continuously upgrade it. They also sell chemical processes for electroplating and PCB manufacturing.
In 2020, IPC EXPO conferred an INNOVATION AWARD to the InduBond® X-PRESS line in the category of PCB FABRICATION for the concept in multilayer press technology of utilizing electromagnetic energy to heat stainless steel separator plates.
“Expect to hear more from us about this exciting new market opportunity for Insulectro and its customers” Ken Parent concluded, “World-class products from world-class suppliers, delivered at breakneck speed from regional distribution centers, coupled with ‘always there’ customer service - it's all about enabling customers to build better circuits faster.”
Insulectro supplies advanced engineered materials manufactured by Isola, DuPont®, LCOA®, CAC, Inc., Pacothane, Focus Tech Chemicals, JX Nippon, TADCO, EMD Performance Materials, Shikoku, Denkai America, Industrial Brush Corporation, Kemmer, and Shur-loc. These products are used by its customers to fabricate complex, multilayer circuit boards and to manufacture printed electronics components. Insulectro serves a broad customer base manufacturing rigid, rigid/flex and flexible circuit boards for applications in a variety of end markets including aeronautics, telecom, data communications, high speed computing, mobile devices, military, and medical. Insulectro combines its premier product offering with local inventory across North America, fabrication capabilities and backed up by expert customer and technical support services.
Suggested Items
Microchip Expands Space-Qualified FPGA Portfolio with New RT PolarFire® Device Qualifications and SoC Availability
07/10/2025 | MicrochipContinuing to support the evolving needs of space system developers, Microchip Technology has announced two new milestones for its Radiation-Tolerant (RT) PolarFire® technology: MIL-STD-883 Class B and QML Class Q qualification of the RT PolarFire RTPF500ZT FPGA and availability of engineering samples for the RT PolarFire System-on-Chip (SoC) FPGA.
Infineon Advances on 300-millimeter GaN Manufacturing Roadmap as Leading Integrated Device Manufacturer (IDM)
07/10/2025 | InfineonAs the demand for gallium nitride (GaN) semiconductors continues to grow, Infineon Technologies AG is poised to capitalize on this trend and solidify its position as a leading Integrated Device Manufacturer (IDM) in the GaN market.
Bell to Build X-Plane for Phase 2 of DARPA Speed and Runway Independent Technologies (SPRINT) X-Plane Program
07/09/2025 | Bell Textron Inc.Bell Textron Inc., a Textron Inc. company, has been down-selected for Phase 2 of Defense Advanced Research Projects Agency (DARPA) Speed and Runway Independent Technologies (SPRINT) X-Plane program with the objective to complete design, construction, ground testing and certification of an X-plane demonstrator.
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.