It’s Only Common Sense: If You’re Not Differentiated, You’re Dead
Alpha Insights, Performance by Design: The Future of PCB Manufacturing in the Midwest
Happy’s Tech Talk #43: Engineering Statistics Training With Free Software
May Mobility Selects Ouster’s Lidar Sensors for Autonomous Shuttle Platform
February 19, 2021 | Business WireEstimated reading time: 1 minute
Ouster, Inc., a leading provider of high-resolution digital lidar sensors for industrial automation, robotics, smart infrastructure, and automotive, announced that it has been selected to provide four lidar sensors per vehicle on May Mobility’s next generation of autonomous shuttles.
Since its founding in 2017, May Mobility has rapidly become one of the most visible and successful leaders in shared-ride autonomous vehicles, providing more than 270,000 rides to date.
Over the past several years, May Mobility has built prototypes with a wide variety of lidar sensor options before deciding on Ouster’s sensors for both short range / wide field of view and mid-range lidar placements. The May Mobility team decided to use Ouster’s digital lidar sensors for their high performance, field-tested reliability, and scalable pricing for larger deployments like those May Mobility plans to roll out in Arlington, Texas, and Higashi-Hiroshima, Japan, in 2021.
“As we expand our reach and evolve our shuttle service, it is important for May Mobility to work with outstanding partners that deliver technology solutions that help us ensure a safe experience. We added Ouster's sensors to our sensor suite for their combination of resolution, range, and reliability and look forward to working with them on upcoming launches,” said Edwin Olson, Founder and CEO of May Mobility.
“May Mobility is a leader in autonomous mobility, and Ouster is excited to help power their next stage of growth. Autonomous shuttles can make cities, campuses, airports, and other congested areas easier and safer to get around for everyone,” said Angus Pacala, co-founder and CEO of Ouster.
In December, Ouster entered into a definitive merger agreement with Colonnade Acquisition Corp. (NYSE: CLA) (“CLA”) in a transaction that would result in Ouster being listed on the NYSE. The transaction is expected to close in the first half of 2021, subject to satisfaction of customary closing conditions.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
American Standard Circuits Achieves Successful AS9100 Recertification
10/14/2025 | American Standard CircuitsAmerican Standard Circuits (ASC), a leading manufacturer of advanced printed circuit boards, proudly announces the successful completion of its AS9100 recertification audit. This milestone reaffirms ASC’s ongoing commitment to the highest levels of quality, reliability, and process control required to serve aerospace, defense, space, and other mission-critical industries.
SEL Showcases Global Factories and Product Development Journey for Manufacturing Day
10/10/2025 | SELSEL is celebrating Manufacturing Day 2025 with the release of a new video showcasing its product development and vertically integrated manufacturing process.
Dymax to Address Key Electronics Assembly Challenges with Light-Cure Solutions at SMTA International 2025
10/09/2025 | DymaxDymax, a global manufacturer of light-curing materials and equipment, will exhibit at SMTA International 2025 in Rosemont, Illinois, October 21–23. Visit booth 2834 to see how Dymax technologies protect components from harsh environments, help meet regulatory requirements, and streamline assembly.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.