Omnispace Demonstrates 5G Satellite Capability with U.S. Navy & Marine Corps
March 15, 2021 | PRNewswireEstimated reading time: 1 minute
Omnispace, the company that is redefining mobile communications by building a global hybrid network, announced the successful demonstration of 5G satellite capability with the National Security Innovation Network (NSIN), along with the Navy and Marine Corps. Omnispace was selected by NSIN in 2020 to pilot its technology in connection with Verizon's new 5G "Living Lab."
This week, Omnispace successfully tested an initial 5G-via-satellite capability in a LinQuest lab demonstration for the U.S. Navy and Marine Corps. A number of commercial-off-the-shelf 5G devices successfully communicated voice and data services via an emulated 5G radio access network (RAN), to Omnispace's on-orbit satellite, leveraging LinQuest Corporation's lab facility in Northern Virginia.
"Omnispace is honored to have been selected to work with the U.S. Navy and Marines to demonstrate 5G capability from space," said Campbell Marshall, Vice President, Government and International Markets, Omnispace LLC. "The development of standards-based 5G non-terrestrial network (NTN) technology powered by Omnispace's S-band spectrum will allow small tactical 5G devices to communicate directly and seamlessly with 5G-capable satellites and terrestrial networks, giving our warfighters ubiquitous global connectivity and true comms-on-the-move."
"5G will be a critical technology for our military operations in the very near future, and those operations aren't limited to dense urban environments where most 5G infrastructure is being deployed," said Marine Corps Lieutenant Colonel Brandon Newell, Director, SoCal Tech Bridge, Naval X, a driving force behind some of the U.S. Department of Defense's (DoD) 5G initiatives. "Truly global, mobile 5G connectivity in aero, maritime and remote areas will be essential across a broad spectrum of our government and military operations."
Omnispace is continuing the development of a global hybrid 5G communications network based on 3GPP standards, which will the ensure security and interoperability of devices all over the world for a wide array of enterprise and government customers.
The company plans to make its direct-to-satellite 5G NTN connectivity solutions available through its 'one global network,' which will utilize the company's existing 2 GHz priority spectrum rights. Initial elements of the Omnispace network will enter into service in 2022.
Suggested Items
CACI Completes Acquisition of Azure Summit Technology
10/31/2024 | BUSINESS WIRECACI International Inc. announced that it has completed its acquisition of Azure Summit Technology, a provider of innovative, high-performance radio frequency (RF) technology and engineering, focused on electromagnetic spectrum, in an all-cash transaction for $1.275 billion.
Biden-Harris Administration Designates Albany NanoTech as First CHIPS for America R&D Flagship
10/31/2024 | U.S. Department of CommerceThe Department of Commerce and Natcast, the operator of the National Semiconductor Technology Center (NSTC), announced the expected location for the first CHIPS for America research and development (R&D) flagship facility.
DuPont, Zhen Ding Technology Group Sign Strategic Cooperation Agreement to Advance High-End PCB Technology Development
10/30/2024 | DuPontDuPont and Zhen Ding Technology Group announced they have entered into a strategic cooperation agreement in advanced printed circuit board (PCBs) technology.
Wearable Technology Market Worth $152.82 Billion by 2029
10/30/2024 | PRNewswireThe global wearable technology market is expected to be valued at USD 70.30 billion in 2024 and is projected to reach USD 152.82 billion by 2029; it is expected to grow at a CAGR of 16.8% from 2024 to 2029 according to a new report by MarketsandMarkets™.
Flexible Thinking: Musings on High Density Interconnections
10/30/2024 | Joe Fjelstad -- Column: Flexible ThinkingPeople have been using high density interconnection (HDI) technology since the early 1980s, although it was not called HDI until the late 1990s. In the 1970s, ’80s, and early ’90s, engineers used HDI methods to develop hybrid circuits, which were later referred to as multichip modules (MCMs). These were arguably the first instantiation of heterogeneous interconnection technology, which has been the industry buzzword for almost a decade. These devices are a way of integrating multiple chips—both integrated circuits and discrete devices (resistors, capacitors, and inductors)—into a single package, typically using ceramic substrates with layers of insulation and metallic inks (often gold) and firing them at high temperatures.