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CACI Completes Acquisition of Azure Summit Technology

10/31/2024 | BUSINESS WIRE
CACI International Inc. announced that it has completed its acquisition of Azure Summit Technology, a provider of innovative, high-performance radio frequency (RF) technology and engineering, focused on electromagnetic spectrum, in an all-cash transaction for $1.275 billion.

Biden-Harris Administration Designates Albany NanoTech as First CHIPS for America R&D Flagship

10/31/2024 | U.S. Department of Commerce
The Department of Commerce and Natcast, the operator of the National Semiconductor Technology Center (NSTC), announced the expected location for the first CHIPS for America research and development (R&D) flagship facility.

DuPont, Zhen Ding Technology Group Sign Strategic Cooperation Agreement to Advance High-End PCB Technology Development

10/30/2024 | DuPont
DuPont and Zhen Ding Technology Group announced they have entered into a strategic cooperation agreement in advanced printed circuit board (PCBs) technology.

Wearable Technology Market Worth $152.82 Billion by 2029

10/30/2024 | PRNewswire
The global wearable technology market is expected to be valued at USD 70.30 billion in 2024 and is projected to reach USD 152.82 billion by 2029; it is expected to grow at a CAGR of 16.8% from 2024 to 2029 according to a new report by MarketsandMarkets™.

Flexible Thinking: Musings on High Density Interconnections

10/30/2024 | Joe Fjelstad -- Column: Flexible Thinking
People have been using high density interconnection (HDI) technology since the early 1980s, although it was not called HDI until the late 1990s. In the 1970s, ’80s, and early ’90s, engineers used HDI methods to develop hybrid circuits, which were later referred to as multichip modules (MCMs). These were arguably the first instantiation of heterogeneous interconnection technology, which has been the industry buzzword for almost a decade. These devices are a way of integrating multiple chips—both integrated circuits and discrete devices (resistors, capacitors, and inductors)—into a single package, typically using ceramic substrates with layers of insulation and metallic inks (often gold) and firing them at high temperatures.
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