Linde, Bluefors to Develop Cryogenic Cooling Solutions for Large-scale Quantum Computing Technology
March 18, 2021 | PRNewswireEstimated reading time: 1 minute
Linde and Bluefors have joined forces to create cooling solutions for large-scale quantum computers. Linde is contributing its vast experience as the world leader in large cryogenic installations. Bluefors brings to the table its ultra-low temperature interface needed for quantum computing. Their combined effort supports this emerging industry by ensuring cryogenics are ready for the next steps in large-scale quantum computing, in terms of cooling power, efficiency and robustness.
In the initial phase of the partnership, the companies focused on identifying how the technologies work best together. Currently, both partners are collaborating on implementing the results to get their joint product ready for market.
"I am happy that we, as two world leaders within their respective sectors, take on this challenge," says John van der Velden, Senior Vice President Global Sales & Technology, Linde Engineering. "The market potential for the technology is significant, since quantum computing will enable complex or real-time task processing, to name just a few examples: in healthcare modelling, banking and finance, autonomous driving, machine learning, and artificial intelligence."
"After our first meetings, it was clear to both Bluefors and Linde that this was a perfect match for the next phases," comments Rob Blaauwgeers, CEO Bluefors. "Linde shares the same values regarding product quality and reliability and has a long experience in providing large scale cryogenics, which is a necessity in the next steps of quantum computing scale-up."
Quantum computers have the potential for computational power that is unattainable by current computers. They can operate exponentially faster than conventional computers and could, thereby, be the solution to today's insurmountable problems. Cryogenics is a critical component in harnessing this quantum power and the ability to cool down large-scale quantum circuits is essential. Together, Linde and Bluefors have embraced this challenge to ensure that the next stage in cryogenics is ready and able to meet this need.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
LPKF Joins productronica’s 50th Anniversary, Showcasing Laser Technology for Electronics Manufacturing
10/10/2025 | LPKF Laser & ElectronicsLPKF Laser & Electronics invites visitors to productronica 2025 in Munich from November 18 to 21. At booth 305 in hall B2, the company will present its portfolio of modern laser technologies for the electronics industry live – from prototyping systems and high-performance depaneling to laser plastic welding for electronic housings and thin glass processing for advanced packaging.
Marco Pieters Appointed ASML Chief Technology Officer
10/09/2025 | ASMLASML Holding NV (ASML) announced the appointment of Marco Pieters as Executive Vice President and Chief Technology Officer, reporting to President and Chief Executive Officer, Christophe Fouquet.
Advanced Rework Technology Inspires Students at National Manufacturing Day 2025
10/08/2025 | A.R.T. Ltd.Advanced Rework Technology Ltd. (A.R.T.), a leading independent IPC-accredited training provider, joined forces with Jaltek, a UK-based electronics manufacturer with over 35 years’ experience in designing and producing high-quality electronic products, to deliver hands-on workshops for students during National Manufacturing Day 2025.
I-Connect007 Releases Episode 5 of Groundbreaking Ultra HDI Podcast Series
10/10/2025 | I-Connect007In Episode 5 “Via Structures,” host Nolan Johnson welcomes back John Johnson, Director of Quality and Advanced Technology at American Standard Circuits. Together, they explore the designer’s perspective on UHDI’s impact on via structures, diving into the metallurgy, chemistry, mechanical considerations, and stackup reduction that provide greater design flexibility and fewer constraints than ever before.
EDADOC Ushers in a New Era of Robotics Innovation
10/07/2025 | Edy Yu, Editor-in-Chief, ECIOOn Sept. 11, Shanghai Zhiyuan Technology Co., Ltd. (MScape) made a stunning debut at Shanghai’s 2025 Fourth North Bund Cybersecurity Forum and Cyber Intelligence Security Frontier Technology and Equipment Exhibition. The company presented the world’s first Dvorak super heterogeneous architecture and the Zhijing T-series-embodied intelligence (robotics) edge computing power platform. This has been a game-changer in the cybersecurity technology field, filling the gap in the domestic robotics core computing power platform.