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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Battalion Advanced Technology, Penn State Launch National Security Research Collaboration

09/02/2026 | PRNewswire
Penn State and Battalion Advanced Technology Ltd, have entered into two research agreements worth up to $6 million to develop advanced semiconductor platforms and high temperature materials that aim to enable next generation energy, transportation, aerospace and industrial systems while also providing critical capabilities for national security.

Microscreen, AGI Corporation Launch MAA, Expanding Capabilities for Both Companies

09/02/2026 | Microscreen
Microscreen and AGI Corporation have formed the Microscreen AGI Alliance (MAA). The alliance adds AGI’s PCB tooling and engineering capabilities to Microscreen’s offerings, while providing Microscreen’s nanocoating technology to AGI’s customers.

Wizerr Launches Engineering AI for Component Manufacturers

09/01/2026 | BUSINESS WIRE
Wizerr AI announced the expansion of its ELX component intelligence engine to component manufacturers.

BEST Inc. Offers Interposer Rework and Precision Solder Ball Attachment Services

09/01/2026 | BEST Inc.
BEST Inc., a leader in electronic component and PC services, is pleased to announce they offer interposer rework and precision solder ball attachment services. Interposer rework is an advanced process used to repair, replace, or modify the interposer that connects critical electronic components within high density assemblies.

Siemens Launches Industrial AI Engineering Agent in Thailand

08/28/2026 | Siemens
Siemens launched the Eigen Engineering Agent in Thailand, bringing its purpose-built industrial AI for automation engineering to the Thai market for the first time.
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