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DCA Manufacturing Achieves AS9100D Aerospace Quality Certification

10/07/2026 | PRNewswire
DCA Manufacturing announced that its Troy, Michigan and Cumberland, Wisconsin facilities have achieved AS9100D certification, the internationally recognized quality management standard for organizations serving the aviation, space and defense industries.

Connect the Dots: Getting the PCB Quote Right

09/30/2026 | Matt Stevenson -- Column: Connect the Dots
Once the PCB design moves from the designer’s hands to the fabricator, the quote process becomes much more than a matter of price. It’s where we determine what it will take to build your board successfully, from materials and capabilities to cost and production requirements. The more closely designers and fabricators work together during this stage, the better the opportunity to identify potential problems before they reach production.

Happy’s Tech Talk #49: Stop! Do You Have a Digital Strategy for the Future?

08/11/2026 | Happy Holden -- Column: Happy’s Tech Talk
I am sure you have been wondering how you will survive this new age of AI, tariffs, China, and the ever-increasing cost of materials and PCB equipment. You cannot just sit back and watch it roll over you. If you wish for your company to survive, you need a “digitalization strategy,” and that includes a way to afford it.

Technica USA and DCT Tackle One of the Biggest Challenges in PCB Cleaning

07/29/2026 | Technica USA
As the industry prepares to explore the critical role of cleaning in today’s increasingly complex PCB manufacturing processes, Technica is gearing up for its upcoming Lunch & Learn event, taking place August 12–13, 2026.

Rewriting Metallization, One Ink at a Time

06/09/2026 | Marcy LaRont, I-Connect007 Magazine
Additive manufacturing has long promised to reshape how electronics are built, but that promise has remained just out of reach for many in the PCB industry who are limited by materials, performance trade-offs, and real-world manufacturability. Electroninks aims to change that equation by rethinking metallization at the chemical level by developing metal-complex inks that challenge established approaches and open new possibilities for advanced packaging, interconnects, and beyond.
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