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Siemens Unveils Next Generation AI-enhanced Electronic Systems Design Software

11/13/2024 | Siemens
Siemens Digital Industries Software announced today the latest advancement in its electronic systems design portfolio. The next generation release takes an integrated and multidisciplinary approach, bringing together Xpedition™ software, Hyperlynx™ software and PADS™ Professional software into a unified user experience that delivers cloud connectivity and AI capabilities to push the boundaries of innovation in electronic systems design.

Rehm Thermal Systems Mexico Wins the Mexico Technology Award 2024 in the Category Convection Soldering

11/13/2024 | Rehm Thermal Systems
Rehm Thermal Systems Mexico has won the Mexico Technology Award in the category convection soldering with the patented mechatronic curtain for convection soldering systems.

HENSOLDT, Lockheed Martin Sign a Memorandum of Understanding

11/12/2024 | Lockheed Martin
On 7 November 2024, Oliver Dörre, CEO of HENSOLDT AG and Paul Lemmo, vice president and general manager Integrated Warfare Systems and Sensors at Lockheed Martin, signed a Memorandum of Understanding on a potential cooperation in the field of maritime command and control systems and radar technologies.

Renesas Jointly Developed World-Class '8-in-1' Proof of Concept with Nidec

11/12/2024 | Renesas
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced the world's first “8-in-1” proof of concept* (PoC) for E-Axle systems for electric vehicles (EV), which controls eight functions using a single microcontroller (MCU).

Agileo Automation Launches E84 PIO Box at SEMICON Europa

11/12/2024 | Agileo Automation
Agileo Automation, a leading provider of control and connectivity solutions for global semiconductor equipment manufacturers, today launches the E84 PIO Box at Booth #C2848.
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