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Dr. Yan Liu of Indium Named as Macny’s 2025 Innovator of the Year

03/20/2025 | Indium Corporation
MACNY, The Manufacturers Association, is proud to announce Dr. Yan Liu, Director of Global Research and Development (R&D) at Indium Corporation, as the recipient of the 2025 Innovator of the Year Award.

DuPont Interconnect Materials Enabling Advancements in Aerospace & Defense, Next-Gen Automotive, and AI

03/19/2025 | DuPont
DuPont Interconnect Solutions (ICS)—a leading material solutions and systems design partner within DuPont Electronics & Industrial that addresses signal integrity and power and thermal management challenges—will showcase the benefits of its materials for printed circuit board (PCB) manufacturing and electronics assembly at IPC APEX Expo.

Facing the Future: Technology Trends Shaping the PCB Market

03/18/2025 | Prashant Patel -- Column: Facing the Future
Each year the PCB market brings innovations, challenges, and opportunities that redefine the playing field. To remain competitive, North American PCB shops must adapt to these trends and leverage them to carve out an advantage. I’ll be exploring the technology trends shaping the PCB market and how can help North American manufacturers thrive in a rapidly evolving industry.

Ventec Presents Cutting Edge Innovations and High-performance Formulas at IPC APEX EXPO 2025

03/14/2025 | Ventec International Group
Ventec International Group is presenting new substrate materials and proven formulas for high-performance PCBs at IPC APEX Expo 2025, alongside the latest advances in manufacturing equipment from Ventec Giga Solutions.

Aismalibar to Showcase Advanced Thermal Management Solutions at APEC 2025

03/13/2025 | Aismalibar
Aismalibar, a global leader in high-performance thermal management materials, is set to exhibit at APEC 2025 (Applied Power Electronics Conference) in Atlanta, Georgia, from March 16–20, 2025. As the premier event for power electronics professionals, APEC provides a crucial platform for industry leaders to explore the latest advancements in thermal interface materials (TIMs), high-performance PCB laminates, and insulated metal substrates (IMS).
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