Lenthor Engineering Adds ESI’s GEODE CO2 Microvia Drilling System
May 10, 2021 | Lenthor EngineeringEstimated reading time: Less than a minute
Lenthor Engineering, Inc., a California-based designer, manufacturer and assembler of flex and rigid-flex printed circuit boards, has purchased ESI’s Geode CO2 microvia drilling system including the optional automated loading and unloading stations.
Rich Clemente, Lenthor’s COO stated, “We are very excited to add to our expansive ESI laser drill line-up. This will be our seventh ESI laser tool on the production floor and our first CO2 tool. We continue to see an increase in demand for buried and stacked microvias in rigid-flex designs. The Geode system will greatly increase our capability to consistently produce micro-vias and reduce carbon debris when laser routing. The loading and unloading stations complement our dedication to automate whenever possible.”
In further comments, CTO Dale Smith said, “The purchase of the ESI CO2 laser will allow blind vias to be lasered with no worries of cutting through the target pad. The CO2 has enhanced cutting performance capable for use with a wide array of materials, especially those used in rigid-flex constructions. The Geode CO2 laser will yield the cleanest via hole for optimizing reliability of the interconnect, satisfying customers whose products demand performance in stressful environments.”
Suggested Items
Stephen Winchell Appointed DARPA Director
06/02/2025 | DARPAStephen Winchell was sworn in today as the 24th director of the Defense Advanced Research Projects Agency.
Uyemura Expands Engineering Team in Great Lakes Region
05/30/2025 | UyemuraAndrew Jin has joined Uyemura’s Engineering Team as Technical Service Engineer for the Midwest. Jin was formerly with Sensient Technologies, Flavors and Extracts Division, where his focus was CO2 emissions and water quality; he also did capital project work with production equipment.
Defining the Ideal PCB Design Data Output
05/27/2025 | Stephen V. Chavez, Siemens EDAAt the heart of delivering successful, manufacturable printed circuit boards lies a vital question: What should your design data output package include to best support manufacturing? The answer: It depends. There are many factors to consider regarding the specific category you’re designing for—such as mil/aero, space, medical, and commercial. Other factors that need to be considered are requirements and engineering intent.
Renesas Partners with Indian Government to Drive Innovation
05/14/2025 | RenesasRenesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced its partnership with the Ministry of Electronics & Information Technology (MeitY), Government of India, to support local startups and academic institutions in the field of VLSI and embedded semiconductor systems.
The Test Connection Inc. Appoints USM Reps as Exclusive Sales Representative in Mexico
05/13/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is pleased to announce the appointment of USM Reps as its exclusive sales representative in Mexico.