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Advanced Electronics Packaging Digest

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Global 300mm Fab Equipment Spending to Reach $227 Billion in 2029 as Buildout Accelerates

10/13/2026 | SEMI
Global 300mm front-end fab equipment spending is projected to reach $149 billion in 2026, up 31% year-over-year, SEMI reported today in its latest 300mm Fab Outlook. Investment is expected to continue growing at double-digit rates through 2029, reaching $227 billion.

Every Layer Interconnect: The Promise, the Pain, and the Practical Limits

07/02/2026 | Anaya Vardya, American Standard Circuits
Every layer interconnect (ELIC) is an architectural statement about how a PCB is built, signaling a fundamental shift in how we think about routing density, vertical interconnect, and the relationship between design and fabrication. To understand what ELIC solves, you have to understand what it replaces. Traditional HDI construction uses a rigid core with sequential build-up layers on one or both sides:configurations such as 2-4-2 or 3-2-3.

Murata Manufacturing Completes New Production Facility in Izumo

04/07/2026 | Murata
Izumo Murata Manufacturing Co., Ltd., a manufacturing subsidiary of Murata Manufacturing Co., Ltd. located in Izumo City, Shimane Prefecture, has completed the construction of a new production building that had been under construction since March 2024.

Wistron Announces 2024 Financials and BOD Results

02/27/2025 | Wistron
Wistron Corp. held a Board of Directors meeting and announced its financial results for 2024. The company reported consolidated revenue of NTD 1,049 billion, operating income of NTD 38,980 million, profit before tax (PBT) of NTD 40,057 million, and profit after tax (PAT) of NTD 17,439 million, with earnings per share (EPS) of NTD 6.11.  

U.S. Department of Commerce Announces CHIPS Incentives Awards with Corning, Edwards Vacuum, and Infinera

01/21/2025 | U.S. Department of Commerce
The U.S. Department of Commerce announced it finalized three separate awards under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
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