It's Only Common Sense: Leveraging AI in Your Sales Strategy
Dan’s Biz Bookshelf: 'Hidden Potential: The Science of Achieving Greater Things'
Trouble in Your Tank: Minimizing Small-via Defects for High-reliability PCBs
Rogers Corporation to Present & Exhibit at IMS in Atlanta
May 18, 2021 | Rogers CorporationEstimated reading time: 2 minutes
Rogers Corporation announced that Technical Marketing Manager, John Coonrod, will present Thermal Management for High Frequency Printed Circuit Boards from 11:45 – 12:00 p.m. on Tue., June 8 and Stripline Circuitry for Millimeter-Wave and Very High Speed Digital from 11:15 – 11:30 p.m. on Wed., June 9 in the MicroApps Theater at the International Microwave Symposium (IMS) in Atlanta.
In addition, Rogers will be showcasing its latest 5G and autonomous vehicle materials and other products in Booth #1621 during IMS, the world’s largest RF and Microwave show, which takes place from Tues. June 8 – Wed., June 9. These products include XtremeSpeed™ RO1200™ laminates and bondplies, RT/duroid® 6035HTC laminates, as well as recently launched SpeedWave™ 300P ultra-low loss prepreg.
XtremeSpeed RO1200 circuit materials are engineered to meet the unique electrical and thermal/mechanical demands of high speed designs. These circuit materials enable system designers the flexibility to design leading edge systems that maximize data throughput and minimize latency in performance demanding applications. With a low dielectric constant of 3.05, and a maximum dissipation factor of 0.0017 @10GHz, XtremeSpeed RO1200 materials provide outstanding signal integrity, reduced signal skew, and reduced cross-talk. Combined with superior thermal/mechanical performance, low CTE, and a halogen free UL 94 V-0 rating, these materials are well suited for the most demanding high layer count applications.
RT/duroid 6035HTC laminates feature a relative dielectric constant of 3.5 at 10 GHz, making them suitable for a wide range of circuits, including amplifiers, couplers, filters, and power combiners/dividers employed in avionic and other military and hi-reliability systems. The laminates incorporate a unique filler material to achieve superior heat-transfer characteristics compared to other high frequency circuit materials with similar dielectric constant. With outstanding thermal conductivity of 1.44 W/m?K as well as low loss, with a loss tangent of 0.0013 at 10 GHz, for excellent high frequency performance, this combination of high thermal conductivity and low dielectric loss translates into improved amplifier performance.
SpeedWave 300P prepreg provides excellent thermal reliability for the most demanding high layer count designs requiring multiple sequential laminations. It also delivers superior fill and flow capability around heavy copper features, a low z-axis expansion for plated through-hole reliability and is CAF resistant. This UL 94 V-0 rated material is compatible with modified FR-4 fabrication processes and lead-free PCB assembly processing and is ideal for 5G mmWave, high resolution 77 GHz automotive radar, aerospace & defense and high speed digital designs.
About Rogers Corporation
Rogers Corporation (NYSE:ROG) is a global leader in engineered materials to power, protect and connect our world. Rogers delivers innovative solutions to help our customers solve their toughest material challenges. Rogers’ advanced electronic and elastomeric materials are used in applications for EV/HEV, automotive safety and radar systems, mobile devices, renewable energy, wireless infrastructure, energy-efficient motor drives, industrial equipment and more. Headquartered in Chandler, Arizona, Rogers operates manufacturing facilities in the United States, Asia and Europe, with sales offices worldwide.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
08/29/2025 | Nolan Johnson, I-Connect007This week, we bring you Global Electronics Association’s Chris Mitchell’s government relations column on—you guessed it—trade deals. TTM is balancing its facilities between East and West. The Global Electronics Association released July numbers for North American PCB shipments, and the news is good. Meanwhile, the corresponding report for EMS might seem like bad news, but that’s misleading. Be sure to look deeper for the rest of the story. Finally, for a bit space-science palate cleansing, I’m sharing news of the latest launch of NASA’s X-37B.
ICZOOM Launches PCB & SMT Services to Strengthen One-Stop Electronics Industry Solution at IIC Shenzhen 2025
08/28/2025 | PRNewswireICZOOM Group Inc., a B2B electronic component products e-commerce platform, successfully exhibited at the 2025 International Integrated Circuit & Component Exhibition and Conference (IIC Shenzhen 2025) held from August 26 to 28 at the Shenzhen Convention & Exhibition Center in Futian District.
AT&S Fuels Future Innovation with 'Young Wilds' Program
08/28/2025 | AT&SToday’s ideas are tomorrow’s innovations: Following a successful debut in the financial year 2024/25, the “Young Wilds” program offers ambitious young professionals at AT&S the opportunity to take on responsibility and accelerate their personal and professional growth.
North American PCB Industry Shipments Up 20.7 Percent in July
08/27/2025 | Global Electronics AssociationThe Global Electronics Association announced today the July 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.00. Total North American PCB shipments in July 2025 were up 20.7% compared to the same month last year.
Mastering PCB Floor Planning
08/28/2025 | Stephen V. Chavez, Siemens EDAPlacement of PCB components is far more than just fitting components onto a board. It’s a strategic and critical foundational step, often called “floor planning,” that profoundly impacts the board’s performance, reliability, manufacturability, and cost. Floor planning ties into the solvability perspective, with performance and manufacturability being the other two competing perspectives for addressing and achieving success in PCB design.