Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Wayve Expands Engineering Leadership to Power Next-Gen Autonomous Driving Technology

06/27/2025 | BUSINESS WIRE
Wayve, a pioneer in Embodied AI for automotive, announces the appointments of Rob Flenniken, Uri Wolfovitz, and Dennis Jackson, strengthening its engineering leadership.

DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model

06/26/2025 | Andy Shaughnessy, I-Connect007
I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.

Siemens Turbocharges Semiconductor and PCB Design Portfolio with Generative and Agentic AI

06/24/2025 | Siemens
At the 2025 Design Automation Conference, Siemens Digital Industries Software today unveiled its AI-enhanced toolset for the EDA design flow.

Agileo Automation Announces Future Expansion of A²ECF-SEMI Automation Framework with SEMI EDA Standards

06/17/2025 | Agileo Automation
Agileo Automation, a leading provider of control and connectivity solutions for global semiconductor manufacturing equipment, announced the future expansion of its A²ECF-SEMI automation framework to include SEMI’s EDA (Equipment Data Acquisition) standards suite.

Siemens Collaborates with Samsung Foundry on Advanced Node Product Certifications and EDA Innovation

06/17/2025 | Siemens
Siemens Digital Industries Software announced a significant expansion of its collaboration with Samsung Foundry, including extending certification for many of Samsung’s most advanced process technologies across Siemens’ comprehensive Electronic Design Automation (EDA) portfolio.
Copyright © 2025 I-Connect007 / Global Electronics Association Publishing Group All rights reserved. Log in