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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

Power Integrity: Effective Decoupling Radius

11/26/2025 | Kirk Fabbri, Siemens EDA
Power delivery on modern systems is an important and challenging problem facing hardware designers. These challenges are even more apparent as device operating speeds and current demands increase. Modern FPGAs, processors, and other devices feature fast switching currents and demand precise voltage levels.

Beyond Design: Radiation and Interference Coupling

05/21/2025 | Barry Olney -- Column: Beyond Design
Radiation and interference coupling pose significant challenges to the performance and reliability of high-speed digital designs. Whether it's the unintended emission of electromagnetic waves or the interaction of signals between adjacent circuits, these phenomena can lead to unwanted noise, signal distortion, and even system malfunctions. Understanding the mechanisms behind radiation and interference coupling is crucial for electronics designers seeking to design robust and efficient systems.

Beyond Design: Key SI Considerations for High-speed PCB Design

03/20/2025 | Barry Olney -- Column: Beyond Design
Over the past two decades, I've simulated numerous complex, high-speed designs for customers creating computer-based products. In addition, I've conducted signal integrity software training courses and led classes on high-speed design. In this month’s column, I will reflect on the key considerations for achieving a successful high-speed PCB design that performs reliably, and I’ll highlight some of the common signal integrity issues that I frequently encounter.

IEEE Researchers Provide Mathematical Solutions to Study 2D Light Interaction in Photonic Crystal Lasers

02/07/2025 | PRNewswire
Laser diodes are semiconductors that generate light and amplify it using repeated reflection or 'optical feedback'. Once the light has achieved desirable optical gain, laser diodes release it as powerful laser beams.

Beyond Design: Embedded Capacitance Material

02/22/2024 | Barry Olney -- Column: Beyond Design
Embedding components into the multilayer PCB substrate can have many benefits, including reduced board size and improved signal integrity. However, embedded capacitance material (which is not really a component but rather part of the substrate) can improve power integrity dramatically by reducing AC impedance and generally enhancing the performance of the product. It takes up no additional space, is easy to implement (because it is compatible with standard FR-4 processes), and can be cost-effective.
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