Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Beyond Design: Key SI Considerations for High-speed PCB Design

03/20/2025 | Barry Olney -- Column: Beyond Design
Over the past two decades, I've simulated numerous complex, high-speed designs for customers creating computer-based products. In addition, I've conducted signal integrity software training courses and led classes on high-speed design. In this month’s column, I will reflect on the key considerations for achieving a successful high-speed PCB design that performs reliably, and I’ll highlight some of the common signal integrity issues that I frequently encounter.

IEEE Researchers Provide Mathematical Solutions to Study 2D Light Interaction in Photonic Crystal Lasers

02/07/2025 | PRNewswire
Laser diodes are semiconductors that generate light and amplify it using repeated reflection or 'optical feedback'. Once the light has achieved desirable optical gain, laser diodes release it as powerful laser beams.

Beyond Design: Embedded Capacitance Material

02/22/2024 | Barry Olney -- Column: Beyond Design
Embedding components into the multilayer PCB substrate can have many benefits, including reduced board size and improved signal integrity. However, embedded capacitance material (which is not really a component but rather part of the substrate) can improve power integrity dramatically by reducing AC impedance and generally enhancing the performance of the product. It takes up no additional space, is easy to implement (because it is compatible with standard FR-4 processes), and can be cost-effective.

Supply Chain Related to Driver ICs Shows Signs of Decoupling

11/21/2022 | TrendForce
Recent observations by market intelligence firm TrendForce suggests that the ongoing expansion of the US semiconductor trade restrictions against China could eventually spread to the display panel industry.

Beyond Design: The Coupling Coup

03/09/2022 | Barry Olney -- Column: Beyond Design
Coupling on a multilayer PCB may be a good or bad thing. On one hand, close coupling of signal traces to reference planes and differential pair signals is the best way to prevent common mode radiation and to mitigate electromagnetic (EM) emission. But on the other hand, close coupling of unrelated signal traces can bring us grief with unintentional crosstalk caused by overlapping EM fields. In this month’s column, I will look at where close coupling should be used and where it should be avoided.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in