Analog Devices, Keysight Collaborate to Speed Development of O-RAN Solutions
June 22, 2021 | Business WireEstimated reading time: 1 minute
Analog Devices, Inc. and Keysight Technologies, Inc., announced a collaboration that accelerates network interoperability and compliance testing for Open RAN radio units (O-RUs).
The companies are collaborating to create a robust test bench to verify the interoperability of a new O-RU that includes ADI’s low-PHY baseband, software-defined transceiver, power, and clock integrated with an Intel© FPGA. Applying Keysight’s Open RAN emulation, signal generation, and signal analysis capabilities to a wide range of use cases improves the testing process, reducing complexity and testing time.
“We are pleased to align our resources with ADI, a leader in O-RU technology solutions, to help service providers realize the full potential of the O-RAN specifications,” said Kailash Narayanan, Vice President and General Manager of Keysight’s Commercial Communications Group. “Keysight and ADI offer technology and test solutions that create an effective bridge between the radio unit and the core network, resulting in the accelerated development and interoperability testing.”
Open RAN technology is expected to account for more than 10 percent of the overall radio access network market by 2025, according to the Dell-Oro Group. The ADI and Keysight collaboration addresses commercial opportunities in this industry that is transitioning towards open, disaggregated, and virtualized RAN (vRAN) architectures.
“As a result of combining our technology, tools and design resources, ADI and Keysight are able to provide the O-RAN ecosystem with a robust platform to quickly develop reliable O-RUs,” said Joe Barry, Vice President of Wireless Communications at Analog Devices. “By working together, we offer our customers the fastest path for developing cost-effective, power-efficient, and interoperable O-RAN based O-RUs.”
An Open RAN infrastructure, based on O-RAN ALLIANCE open interfaces, enables mobile operators to create a robust multi-vendor network environment designed to streamline the delivery of advanced 5G services for enterprises in manufacturing, financing, transportation, logistics and healthcare. Performance validation of O-RUs and interoperability testing between network elements from the edge of the RAN to the 5G core (5GC) allows mobile operators to effectively deploy O-RAN in multi-vendor 5G networks.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Würth Elektronik Participates in EU Initiative PROACTIF for Cutting-edge Drone and Robotics Solutions
10/14/2025 | Wurth ElektronikWürth Elektronik is a partner in the visionary EU project PROACTIF, funded under the Chips Joint Undertaking (Chips JU). The international consortium of 42 partners from 13 countries aims to strengthen Europe’s technological sovereignty i
Dymax to Address Key Electronics Assembly Challenges with Light-Cure Solutions at SMTA International 2025
10/09/2025 | DymaxDymax, a global manufacturer of light-curing materials and equipment, will exhibit at SMTA International 2025 in Rosemont, Illinois, October 21–23. Visit booth 2834 to see how Dymax technologies protect components from harsh environments, help meet regulatory requirements, and streamline assembly.
The Latest Issue: Advanced Electronics Packaging Digest to Explore Critical Minerals, Substrates, and Reliability Standards Driving Next-Gen Electronics
10/09/2025 | I-Connect007I-Connect007 is pleased to announce the upcoming issue of Advanced Electronics Packaging Digest (AEPD) on October 13, 2025, featuring expert insights on the technologies shaping the future of advanced packaging. As the electronics industry evolves, this issue takes a closer look at the materials, designs, and standards redefining performance and reliability across global markets.
The Power Integrity Issue: Design007 Magazine October 2025
10/08/2025 | I-Connect007 Editorial TeamAs technologies such as chiplets and 3D-IC continue to proliferate, solid knowledge of PI design techniques will become a critical tool in your toolbox. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
AT&S Plans Entry Into the Defense Sector
10/02/2025 | AT&SIn times of global uncertainty and geopolitical tension, AT&S is expanding its portfolio to include the defense sector. As a globally leading provider of high-end IC substrates and printed circuit boards, the company is responding to growing demand for security-relevant solutions and emphasizing its social responsibility. This demand will be addressed from its site in Leoben, Austria.