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Indium Corporation Expert to Present at High-Temperature Electronics Network Conference

06/18/2024 | Indium Corporation
Indium Corporation Technical Manager for Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation at the International Conference and Exhibition on High-Temperature Electronics Network (HiTEN 2024), taking place July 15-17 in Edinburgh, Scotland, United Kingdom.

Traditional Materials, High-Frequency Boards?

06/18/2024 | I-Connect007 Editorial Team
Not long ago, high-frequency and RF boards required specialized laminates, which tend to be costly and difficult to manufacture. But now, high-frequency designers use traditional PCB laminates for certain high-frequency boards. How is this possible? For some insight, we asked Ed Kelley, founder of Four Peaks Innovation and former CTO of Isola, to discuss how traditional materials have improved and what this means to PCB designers and design engineers today.

Marcy’s Musings: All Things Material 

06/18/2024 | Marcy LaRont -- Column: Marcy's Musings
It wasn’t until I had been around the business block a bit that I truly understood the impact of inventory on one’s P&L. How a company manages its inventory has a tremendous effect on its financials. I saw many situations where “fixers” were hired to get an organization financially back on track. The companies then experienced some of their greatest gains in the first year by simply getting their inventory under control. This is material management at its most base level for a business, and in this June issue of PCB007 Magazine, we are talking about all things “material,” a popular and ever-evolving topic for PCB fabricators. 

Looking Into Space: EIPC Summer Conference, Part Two

06/17/2024 | Pete Starkey, I-Connect007
“Innovative Development of PCB Technology and Design” was the theme of the second session of the 2024 EIPC Summer Conference, June 4-5, at the European Space Centre, Noordwijk, The Netherlands.

SEMI FlexTech Invites Proposals for Flexible Hybrid Electronics Innovations With Cash Awards of Up to $1 Million

06/17/2024 | SEMI
FlexTech, a SEMI Technology Community, issued a Request for Proposals (RFP) to advance flexible hybrid electronics (FHE) technologies, including the development of advanced materials and additive processing. Selected projects will receive cash awards ranging from $250,000 to $1 million.
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