Paving the Way for UV-enabled Flexible Wearable Tech
August 9, 2021 | Nanyang Technological UniversityEstimated reading time: 1 minute

To enable the development of wearable devices that possess advanced ultraviolet (UV) detection functions, scientists from NTU Singapore have created a new type of light sensor that is both flexible and highly sensitive. While invisible to the human eye, UV rays surround us in our environment, and excessive exposure can cause health issues including skin cancer and premature skin ageing. The intensity of UV rays is typically reported through an index during weather reports. A wearable device, such as a T-shirt or watch that monitors the actual personal UV exposure throughout the day, would be a useful and more accurate guide for people seeking to avoid sun damage.
In their study, which was featured on the front cover of the peer-reviewed journal ACS Nano, the NTU researchers reported that their flexible UV light sensors were 25 times more responsive, and 330 times more sensitive, than existing sensors, exceeding the performance level required for optoelectronic applications – or light-based electronics.
The NTU team created their flexible UV light sensors on a semiconductor wafer 8 inches in diameter, using free-standing single-crystalline layers of gallium nitride (GaN) and aluminium gallium nitride (AlGaN), arranged using membranes that consist of two different thin semiconductor layers (heterostructure membranes).
This type of semiconductor structure, which can be fabricated using existing industrial compatible methods, allows the material to be easily bent, making it ideal for use in flexible sensors. At the same time, the chemical composition of the material changes with depth, meaning that high performance is maintained even when it comes under strain.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Fresh PCB Concepts: Designing for Success at the Rigid-flex Transition Area
08/28/2025 | Team NCAB -- Column: Fresh PCB ConceptsRigid-flex PCBs come in all shapes and sizes. Manufacturers typically use fire-retardant, grade 4 (FR-4) materials in the rigid section and flexible polyimide materials in the flex region. Because of the small size, some rigid-flex PCBs, like those for hearing aid devices, are among the most challenging to manufacture. However, regardless of its size, we should not neglect the transition area between the rigid and flexible material.
Global Flexible PCB Output Expected to Surpass $20 Billion by 2025, with AI Glasses Emerging as a New Growth Driver
08/25/2025 | TPCAThe Taiwan Printed Circuit Association (TPCA) and the Industrial Technology Research Institute (ITRI) released the "2025 Global Flexible PCB Industry Outlook" in August.
Nano Silver Inks Market Forecast Report 2025-2030
08/20/2025 | Globe NewswireThe Nano Silver Inks Market is expected to grow from USD 427.415 million in 2025 to USD 836.160 million in 2030, at a CAGR of 14.36%.
Flexible Circuit Technologies to Host Free Flex Heater Webinar
08/18/2025 | Flexible Circuit TechnologiesGlobal Supplier of flexible circuits, flex design services, and assembly/box-build services, Flexible Circuit Technology will host their latest webinar, "Thermal Precision Meets Flexibility: The Technology Behind Heater Circuits" on Tuesday, August 26th, 2025 at 11 AM EDT.
Trouble in Your Tank: Metallizing Flexible Circuit Materials—Mitigating Deposit Stress
08/04/2025 | Michael Carano -- Column: Trouble in Your TankMetallizing materials, such as polyimide used for flexible circuitry and high-reliability multilayer printed wiring boards, provide a significant challenge for process engineers. Conventional electroless copper systems often require pre-treatments with hazardous chemicals or have a small process window to achieve uniform coverage without blistering. It all boils down to enhancing the adhesion of the thin film of electroless copper to these smooth surfaces.