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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Global EMS Market to Grow by $202.7 Billion Through 2030

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Cadence announced the Maestro AI Model Portfolio, which powers Cadence® AI Super Agents across semiconductor and system design workflows.

qBraid Announces qBraid OS for Operating Quantum Computing Services

10/23/2026 | PRNewswire
qBraid introduced qBraid OS, software that quantum hardware providers and system operators can use to run their systems and make them available to users, whether as a commercial service or for internal use.

Amkor Technology, NVIDIA Expand AI Infrastructure Partnership

10/21/2026 | BUSINESS WIRE
Amkor Technology, Inc., a leading provider of outsourced semiconductor packaging and test services, announced additional investments in South Korea for capacity expansion initiatives with NVIDIA.

Mercedes-Benz, NVIDIA Expand Partnership on Automated Driving

10/19/2026 | NVIDIA
Mercedes-Benz and NVIDIA announced that they will extend their strategic partnership to advance the next generation of automated driving systems.

Scale-Up: From Monolithic Silicon to Advanced Packaging

10/15/2026 | Chetan Arvind Patil, Marvell Technology
This is the first in a three-part series exploring scale-up, scale-out, and scale-across in advanced packaging. Scale-up focuses on increasing compute capability, memory capacity, and communication bandwidth within tightly integrated computing systems. Scale-out expands computing capacity by connecting multiple servers, compute nodes, and racks through high-speed networks. Scale-across focuses on integrating and coordinating diverse computing resources, technologies, and workloads across data centers to improve overall efficiency and resource utilization.
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