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HARTING 3D-Circuits Leads 3D-MID Innovation: Transforming Consumer Electronics with Advanced Technology

03/27/2025 | PRNewswire
The consumer electronics industry is experiencing a remarkable transformation, propelled by rapid technological advancements and an increasing demand for compact, efficient, and multifunctional devices. Central to this evolution is 3D-MID (Three-Dimensional Mechatronic Integrated Devices) technology, which redefines design standards and drives innovation.

Real Time with... IPC APEX EXPO 2025: Transforming Engineering With Digital Solutions from Zuken

03/27/2025 | Real Time with...IPC APEX EXPO
Bob Potock discusses Zuken's focus on digital engineering and a move away from traditional document-based processes to model-based designs. This change improves product definition, reduces design errors, and optimizes product parameters. Bob notes that the IPC-2581 standard is crucial for connecting designs, while AI enhances design efficiency.

Global PCB Connections: A Field Engineer’s Perspective on the Top 10 Trends to Watch

03/27/2025 | Jerome Larez -- Column: Global PCB Connections
As a field application engineer for a major Chinese PCB company, I see firsthand the challenges and, more excitingly, the trends shaping our industry. Talking to engineers, designers, and procurement teams worldwide, one thing is clear: PCBs have come a long way, but we’re barely scratching the surface of what’s possible. Here are 10 trends I believe will define our industry over the next decade.

Würth Elektronik Now an Infineon ‘Preferred Partner’

03/13/2025 | Wurth Elektronik eiSos
Würth Elektronik, one of the leading manufacturers of electronic and electromechanical components, is broadening its collaboration with semiconductor manufacturers.

Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI

03/12/2025 | Ventec International Group
Ventec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.
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