Boeing's Latest 737-9 ecoDemonstrator Testing Crane A&Es New Long-range Sensing
September 28, 2021 | Crane Aerospace & ElectronicsEstimated reading time: 1 minute
Crane Aerospace & Electronics, a segment of Crane Co., has been selected to feature its new Long-Range Wireless Tire Pressure Sensors on Boeing’s 2021 737-9 ecoDemonstrator program.
Crane A&E’s Long-Range Tire Pressure Sensors are installed on two of the aircraft’s four main landing gear wheels and represent an innovative evolvement of Crane A&E’s wireless sensing technology. Crane A&E’s new sensors communicate with a maintenance tablet with a Crane A&E-developed application that allows maintenance personnel to easily access and analyze tire pressure data. The system enhances tire-related safety, reduces maintenance and operating cost, maximizes tire life and permits predictive maintenance.
“For years, we have had the honor of supplying industry-leading wireless tire pressure sensing to our global customer base,” said Hilary King, Crane A&E VP & GM, Sensing & Power Systems. “Our new Long-Range Wireless Tire Pressure Sensors are the latest in our ongoing commitment to provide leading edge sensing solutions to improve aviation operations for our commercial and military customers. We are pleased to demonstrate our new technology on Boeing’s prestigious ecoDemonstrator.”
Boeing’s ecoDemonstrator program accelerates innovation by taking promising technologies out of the lab and testing them in the air to solve real-world challenges for airlines, passengers and the environment. Eight airplanes have served as flying test beds for the program since it began in 2012.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Spirit Electronics Named Authorized Distributor for Microchip Technology
04/17/2026 | Globe NewswireSpirit Electronics, a vertically integrated electronics design and manufacturing solutions provider serving the military and aerospace markets, announced that it has been designated as an authorized distributor for the Americas for Microchip Technology, a broadline supplier of semiconductors committed to making innovative design easier through total system solutions.
The Future of Reflow Soldering Is Here
04/16/2026 | Real Time with... APEX EXPOMichael Hanke discusses how Rehm Thermal Systems is revolutionizing thermal solutions in electronics assembly with their innovative flux-free, no-clean soldering process. This is truly a game changing process that eliminates chamber cleaning and streamlines production. Developed with paste suppliers, this advanced technology promises significant time and cost savings while ensuring high-quality results.
The Global Electronics Association Is Future Forward
04/17/2026 | Real Time with... APEX EXPOJohn W. Mitchell, CEO of the Global Electronics Association, discusses the association's comprehensive role in standards, training, sustainability, and global advocacy. He highlights the industry's critical importance and the association's efforts in workforce development and adapting to AI. The conversation also touches on future trends like personal robotics and innovative approaches to industry standards.
MEIKO Electronics Expands ASEAN Footprint with New Vietnam Subsidiary to Support Growing Demand
04/16/2026 | MeikoMEIKO ELECTRONICS CO., LTD. has announced that, at its Board of Directors meeting held on April 8, 2026, the company resolved to establish a wholly owned subsidiary, MEIKO ELECTRONICS YEN QUANG CO., LTD. (MKYQ), in Phu Tho Province, Vietnam.
From AI to AEP, an Impressive Array of Keynotes at APEX EXPO 2026
04/17/2026 | Marcy LaRont and Nolan Johnson, I-Connect007Each year at APEX EXPO, the Global Electronics Association provides an impressive lineup of keynote speakers to kick off the largest electronics manufacturing event in North America. This year included four keynote speeches, on topics ranging from the promise and peril of AI to the power of electronics, quantum computing, and the importance of heterogeneous integration in advanced electronics packaging.