Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Prague PEDC: Call for Abstracts Deadline July 31

07/16/2025 | Pan-European Electronics Design Conference (PEDC)
The second Pan-European Electronics Design Conference (PEDC) will take place Jan. 21-22, 2026, in Prague, Czech Republic. The call for abstracts deadline is July 31. Organized jointly by the German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association PEDC serves as a European platform for knowledge exchange, networking, and innovation in electronics design and development.

The Pulse Design: Constraints for the Next Generation

07/16/2025 | Martyn Gaudion -- Column: The Pulse
In Europe, where engineering careers were once seen as unpopular and lacking street credibility, we have been witnessing a turnaround in the past few years. The industry is now welcoming a new cohort of designers and engineers as people are showing a newfound interest in the profession.

Staying—and Excelling—in Their Lane

07/16/2025 | Nolan Johnson, SMT007 Magazine
Michael Seltzer, chief commercial officer at Zentech Manufacturing, helps define his company’s niche and why it has mattered to them over nearly three decades. Should a company shift with the markets or stay true to its mission? Find out how Michael has helped the company truly understand its vision.

Flexible Circuit Technologies Welcomes Regional Business Development Manager Derek Rossberg

07/15/2025 | Flexible Circuit Technologies
Flexible Circuit Technologies a Minnesota-based flexible circuit and advanced electronics contract manufacturer, welcomes Derek Rossberg as Regional Business Development Manager.

KONIG Launches KP400: Advanced 3D Digital Conformal Coating System for High-Density Electronics

07/15/2025 | KONIG
KONIG, a leader in electronic packaging protection solutions, is proud to announce the launch of the KP400 3D Digital Packaging Solution—a breakthrough conformal coating system that brings new levels of precision, speed, and material efficiency to electronics manufacturing.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in