Teledyne Imaging's Infrared Sensors Launched Aboard the James Webb Space Telescope
December 30, 2021 | TeledyneEstimated reading time: 2 minutes

Teledyne Technologies Incorporated congratulates NASA, the European Space Agency (ESA), and the Canadian Space Agency (CSA) on the successful launch of the James Webb Space Telescope (JWST). Teledyne provided 15 extremely sensitive H2RG infrared detectors that are used in three of the four science instruments of JWST: the Near-Infrared Camera (NIRCam), the Fine Guidance Sensor (FGS), and the Near-Infrared Spectrograph (NIRSpec). Ten Teledyne detectors in NIRCam will study the structure and morphology of the universe. Three Teledyne detectors in FGS will be used to point and stabilize the telescope. Two Teledyne detectors in NIRSpec will reveal information about chemical composition, temperature, and velocity of what JWST observes. Teledyne also provided the SIDECAR ASIC focal plane electronics that operate the H2RG detectors.??
Teledyne is proud to provide most of the detectors for NASA's flagship astronomy missions. JWST's predecessor, the Hubble Space Telescope, uses Teledyne detectors for imaging in ultraviolet, visible, and infrared light. JWST, however, will concentrate solely on infrared imaging and spectroscopy. This is because JWST will explore the very distant universe, for which ultraviolet and visible emissions have been stretched by the expansion of the universe into infrared wavelengths, a process known as redshift. Teledyne's infrared detectors enable JWST to observe the first stars and galaxies, allowing scientists to understand the early evolution of the universe. In 2027, NASA will launch its next flagship astrophysics mission, the Roman Space Telescope, for which Teledyne recently delivered the infrared detectors.??
"Teledyne is extremely proud to have provided the detectors that are the 'eyes' of groundbreaking astronomy and astrophysics missions," said Robert Mehrabian, Chairman, President and Chief Executive Officer of Teledyne. "For decades, scientists have used our ground-based and space-based detectors to look outward to our solar system, to the stars and exoplanets of the Milky Way, and to galaxies millions and billions of light years from Earth. More recently, our detectors have been extensively used to look down upon the Earth, monitoring pollution and greenhouse gas emissions, and enabling environmental science and climatology."??
For example, Teledyne provided imaging detectors for the Advanced Baseline Imager in the U.S. National Oceanic and Atmospheric Administration's Geostationary Operational Environmental Satellites (GOES), and NASA's Orbiting Carbon Observatory-2 (OCO-2). Teledyne sensors are also included in multiple European Union Sentinel satellites, including the anthropogenic CO2 emissions monitoring (CO2M) mission and the Copernicus Hyperspectral Imaging Mission for the Environment (CHIME).??
In addition to imaging sensors, a Teledyne system provides the electricity that operates the Curiosity and Perseverance Mars Rovers; the electrical power is produced by Teledyne's Multi-Mission Radioisotope Thermoelectric Generator (MMRTG).
Suggested Items
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Orbel Corporation Integrates Schmoll Direct Imaging
06/04/2025 | Schmoll AmericaOrbel Corporation in Easton, PA, proudly becomes the first PCM facility in the U.S. equipped with Schmoll’s MDI Direct Imaging system. This installation empowers Orbel to support customers with greater precision and quality.
Key Insights on Photoresist for Defect Reduction
05/21/2025 | I-Connect007 Editorial TeamIn PCB manufacturing, understanding the intricacies of the photoresist process is crucial for achieving high-quality results. Industry experts Josh Krick, a technical service engineer at IEC, and Tim Blair, a PCB imaging specialist at Tim Blair LLC, share their knowledge on the essential stages of photoresist application, highlight critical advancements in materials, and discuss common defects encountered during production. They share best practices and innovative solutions to enhance the manufacturing process, reduce defects, and ensure efficiency and reliability in high-tech applications.
NXP Unveils Third-Generation Imaging Radar Processors for Level 2+ to 4 Autonomous Driving
05/09/2025 | NXP SemiconductorNXP Semiconductors N.V. unveiled its new S32R47 imaging radar processors in 16 nm FinFET technology, building on NXP’s proven expertise in the imaging radar space.
SEMICON Europa 2025 Call for Abstracts Opens for Advanced Packaging Conference and MEMS & Imaging Summit
05/05/2025 | SEMISEMI Europe announced the opening of the call for abstracts for SEMICON Europa 2025, to be held November 18-21 at Messe München in Munich, Germany. Selected speakers will share their expertise at the Advanced Packaging Conference (APC), MEMS & Imaging Sensors Summit, and during presentations on the show floor.