Marcy’s Musings: Operating Without a Rulebook
It’s Only Common Sense: Hire for Hunger, Train for Skill
Dan’s Biz Bookshelf: ‘The 'NVIDIA Way: Jensen Huang and the Making of a Tech Giant’
Lockheed Martin Upgrades Sensor Systems On Egypt’s Apache Fleet Under New Contract
January 9, 2022 | Lockheed MartinEstimated reading time: 1 minute
Lockheed Martin received a $102 million contract award to upgrade 25 of Egypt’s AH-64D Apaches to the E-model version of the aircraft.
This modernization for the Egyptian Air Force includes Lockheed Martin’s Gen III Target Acquisition Designation Sight/Pilot Night Vision Sensor (Gen III TADS/PNVS) and the Gen III Day Sensor Assembly (Gen III DSA).
The award is part of an indefinite-delivery/indefinite-quantity (ID/IQ) contract signed with the U.S. Army. The ID/IQ serves as the contracting vehicle to provide Gen III DSA and Gen III TADS/PNVS systems and services.
Under the order, Lockheed Martin is delivering the upgraded sensor kits as part of a remanufacture effort to upgrade D-model Apaches to E-models.
"Lockheed Martin is committed to a strong and sustained partnership with our customers in the United States and around the world," said Tom Eldredge, Director of Lockheed Martin's Missiles and Fire Control Rotary Wing Sensors program. "This contract enables us to respond rapidly to Egypt’s emerging defense needs, including requirements for new sensor systems and upgrades."
The work will be performed at the Boeing Apache Helicopter Plant in Mesa, Arizona with an estimated completion date of July 2024.
Gen III TADS/PNVS, known as the "eyes of the Apache," provides pilots with long-range, precision engagement and pilotage capabilities for safe flight during day, night and adverse weather missions. Gen III DSA increases Gen III TADS/PNVS designation and ranging capabilities to fully accommodate current weapons and those planned for the future.
The upgraded sensor enables Apache pilots to see high-resolution, high-definition, near-infrared and color imagery on cockpit displays. Gen III DSA also provides a new laser pointer marker that improves coordination with ground troops, and an updated multi-mode laser with eye-safe range designation that supports flight in urban environments and critical training exercises.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Future-proof Laser Depaneling for PCBs with Photonics
04/10/2026 | Real Time with... APEX EXPOBill Solari of Photonics Systems USA outlines the advantages of laser depaneling for circuit board manufacturing. We learn that this advanced technology addresses rising material costs by increasing panel yield and improving edge quality. This process provides precision, suitability for medical applications, and cost-saving benefits, including the elimination of cleaning steps. There have been significant advancements in laser depaneling, offering a competitive and efficient solution for modern electronics production.
Bold Laser Automation Introduces Precision Laser Cleaning System for Advanced Manufacturing
03/27/2026 | PRNewswireBold Laser Automation, Inc. has introduced the LPCl1820UV Laser Precision Cleaning System, a Class 1, industrial laser platform engineered for high-precision surface cleaning and thin-film removal in demanding manufacturing environments.
CEA-Leti, NcodiN Partner to Industrialize 300 mm Silicon Photonics
03/11/2026 | NcodiNCEA-Leti and NcodiN, a French deep-tech startup pioneering nanolaser-enabled photonic interconnects, announced a strategic collaboration to industrialize NcodiN’s optical interposer technology on a 300 mm integrated photonics process.
Altus Supports Ei Electronics with LPKF Laser Depaneling Technology
03/09/2026 | Altus GroupAltus Group, a leading distributor of capital equipment for the electronics manufacturing industry, has supported Ei Electronics, Ireland’s largest manufacturer of home life-safety devices, with the installation of an LPKF CuttingMaster 2240 laser depaneling system to enhance PCB singulation and support growing production volumes.
Semtech Expands Data Center Portfolio with Acquisition of HieFo Corporation
03/05/2026 | SemtechSemtech Corporation, a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, announced the acquisition of HieFo Corporation (HieFo), a California-based private manufacturer of high-efficiency Indium Phosphide (InP) optoelectronic devices for optical transceivers used across data center interconnects (DCI) and intra-data center interconnects.