Lockheed Martin Upgrades Sensor Systems On Egypt’s Apache Fleet Under New Contract
January 9, 2022 | Lockheed MartinEstimated reading time: 1 minute

Lockheed Martin received a $102 million contract award to upgrade 25 of Egypt’s AH-64D Apaches to the E-model version of the aircraft.
This modernization for the Egyptian Air Force includes Lockheed Martin’s Gen III Target Acquisition Designation Sight/Pilot Night Vision Sensor (Gen III TADS/PNVS) and the Gen III Day Sensor Assembly (Gen III DSA).
The award is part of an indefinite-delivery/indefinite-quantity (ID/IQ) contract signed with the U.S. Army. The ID/IQ serves as the contracting vehicle to provide Gen III DSA and Gen III TADS/PNVS systems and services.
Under the order, Lockheed Martin is delivering the upgraded sensor kits as part of a remanufacture effort to upgrade D-model Apaches to E-models.
"Lockheed Martin is committed to a strong and sustained partnership with our customers in the United States and around the world," said Tom Eldredge, Director of Lockheed Martin's Missiles and Fire Control Rotary Wing Sensors program. "This contract enables us to respond rapidly to Egypt’s emerging defense needs, including requirements for new sensor systems and upgrades."
The work will be performed at the Boeing Apache Helicopter Plant in Mesa, Arizona with an estimated completion date of July 2024.
Gen III TADS/PNVS, known as the "eyes of the Apache," provides pilots with long-range, precision engagement and pilotage capabilities for safe flight during day, night and adverse weather missions. Gen III DSA increases Gen III TADS/PNVS designation and ranging capabilities to fully accommodate current weapons and those planned for the future.
The upgraded sensor enables Apache pilots to see high-resolution, high-definition, near-infrared and color imagery on cockpit displays. Gen III DSA also provides a new laser pointer marker that improves coordination with ground troops, and an updated multi-mode laser with eye-safe range designation that supports flight in urban environments and critical training exercises.
Suggested Items
IEEE Study Describes Breakthroughs in Semiconductor Nanolasers for Ultra-Efficient Optical Technologies
06/25/2025 | PRNewswireA new wave of innovation is transforming the future of optical technologies, driven by rapid advancements in semiconductor nanolasers. These advances are essential for future applications such as on-chip optical communication and neuromorphic computing, which require compact, energy-efficient light sources.
Excellon Installs COBRA Hybrid Laser at Innovative Circuits
06/23/2025 | ExcellonExcellon is pleased to announce the successful installation of a second COBRA Hybrid Laser System at Innovative Circuits, located in Alpharetta, Georgia. The Excellon COBRA Hybrid Laser System uniquely combines both UV and CO₂ (IR) laser sources on a single platform—making it ideal for high-density prototype and production printed circuit boards (PCBs).
The Chemical Connection: Through-glass Vias in Glass Substrates
06/24/2025 | Don Ball -- Column: The Chemical ConnectionThis month’s theme is vias and how best to ensure via quality and reliability. I don’t have much expertise in this process area or much to contribute that most of you don’t already know. However, I’ve recently become peripherally involved in a via technology that may be of more than academic interest to some of us. It entails putting vias in a material not usually associated with PCB manufacturing: through-glass vias (TGVs) in glass substrates.
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Altus, Danutek Expand Partnership with LPKF to Offer Laser Plastic Welding Solutions
05/21/2025 | Altus GroupAltus Group, a leading supplier of capital equipment and service support for the electronics manufacturing sector in the UK and Ireland, and its sister company Danutek, which serves Central and Eastern Europe, are expanding their technology offering through an enhanced partnership with LPKF, a specialist in laser-based manufacturing solutions.