Micross CMS Center of Excellence, Crewe, UK Receives Nadcap Certification
January 24, 2022 | Micross Components, Inc.Estimated reading time: 2 minutes

Micross Components, Inc., a leading global provider of mission-critical microelectronic components and services for high-reliability aerospace, defense, space and industrial applications, is proud to announce that our Component Modification Services (CMS) Center of Excellence in Crewe, UK received Nadcap certification. Nadcap (National Aerospace and Defense Contractors Accreditation Program) is an industry-managed approach to conformity assessment of 'special processes' that brings together technical experts from prime contractors, suppliers and representatives from government to work together and establish requirements for approval. Nadcap accreditation requires a contractor to be AS9100 certified with QMS requirements in place, and demonstrates that the supplier meets all the requirements for specific aerospace industry special processes.
Micross has successfully completed the in-depth process requirements of a Nadcap audit on the BGA Re-balling and Robotic Hot Solder Dip (RHSD) processes at its Crewe facility in England. The Crewe CMS Center of Excellence joins Micross’ Nadcap certified CMS Center of Excellence in Manchester, New Hampshire, and the pending Nadcap certified CMS Center of Excellence in Round Rock, Texas, as being one of the first companies to gain this prestigious certification for the special processes of RHSD and BGA Re-balling. Nadcap certification demonstrates the continued commitment of Micross to operate at the leading edge of component modification. Micross is fully committed to operating at the highest professional level of operation, and is also compliant to the international standards for RHSD (GEIA-STD-0006) and BGA Re-balling (IEC TS 62647-4), whilst also operating to the stringent requirements of the aerospace standard AS9100.
The Spin-Torque, Persistent 1Gb QED MRAM, 32M x 32 is the latest offering in Micross’ new MRAM family, and available as a NASA/Goddard Space EEE-INST-002, Level 2 PEM. This new device is available in two variants, either a Radiation Tolerant or as a Non-Rad device, packaged in a plastic encapsulated 17mm x 15mm 142 solder-ball BGA . All Micross pMTJ STT-MRAM devices provide near infinite endurance with greater than 10-year data retention across the -40°C to +125°C temperature range, as well as a voltage operating range of 2.70-3.60V with a guaranteed minimum access time of 45ns across the full military temperature range of -55°C to +125°C.
“We are very pleased that our CMS Center of Excellence in Crewe has been accredited with the prestigious Nadcap certification. The globally acclaimed Nadcap certification, acknowledges and reinforces the best-in-class microelectronics services provided by our Component Modification Services group. The Nadcap certification of our Crewe operations is a reflection of our values and mission to support customers’ system-critical requirements through delivering hi-reliability microelectronic components and services on-time and to specification,” stated Graham Jefferies, Managing Director of Micross Components, Ltd.
Suggested Items
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
SolderKing’s Successful Approach to Modern Soldering Needs
06/18/2025 | Nolan Johnson, I-Connect007Chris Ward, co-founder of the family-owned SolderKing, discusses his company's rapid growth and recent recognition with the King’s Award for Enterprise. Chris shares how SolderKing has achieved these award-winning levels of service in such a short timeframe. Their secret? Being flexible in a changing market, technical prowess, and strong customer support.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
Breaking Silos with Intelligence: Connectivity of Component-level Data Across the SMT Line
06/09/2025 | Dr. Eyal Weiss, CybordAs the complexity and demands of electronics manufacturing continue to rise, the smart factory is no longer a distant vision; it has become a necessity. While machine connectivity and line-level data integration have gained traction in recent years, one of the most overlooked opportunities lies in the component itself. Specifically, in the data captured just milliseconds before a component is placed onto the PCB, which often goes unexamined and is permanently lost once reflow begins.