Sixteen Indium Corporation Experts Certified by SMTA
April 4, 2022 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation is pleased to announce that 16 employees have earned SMTA certification as part of its ongoing mission to invest in its technical talent to ensure customer success through professional development.
These team members join several of their colleagues around the globe as Certified SMT Process Engineers (CSMTPEs):
- Timothy Raner, research associate
- Ryan Mayberry, technical support engineer
- Dr. Casey Rowland, research chemist
- Dr. Jay Decker, research chemist
- Jenny Gallery, product specialist
- Dr. Mohan Gamage, research chemist
- Tyler Hutchinson, senior product specialist
- Brian Rundell, technical support engineer
- Tyler Richmond, research associate
- Joseph Hertline, product manager – ESM/power electronics
- Elaina Montague, research chemist
- Matthew Gruber, technical support engineer
- John Swick, technical sales engineer – automotive
- Dr. Arnab Dasgupta, research technologist
- Claire Hotvedt, product development specialist
- Dr. Hyoryoon Jo, research chemist
SMTA's CSMTPE Certification is a unique program that is sponsored by the Surface Mount Technology Association (SMTA), which recognizes and certifies competence across the entire SMT assembly process at an engineering level. This certification is one of the electronics assembly industry's most respected validations of process excellence.
Download The Printed Circuit Assembler’s Guide to… Solder Defects by Christopher Nash and Dr. Ronald C. Lasky. You can also view other titles in our full I-007e Book library here.
Suggested Items
Winners of IPC Hand Soldering and Rework Competition Vietnam 2024 Announced
09/19/2024 | IPCIn conjunction with NEPCON Vietnam 2024, IPC hosted its popular IPC Hand Soldering and Rework Competition in Hanoi, Vietnam, September 11-13. Thirty-nine competitors from 16 electronics companies and one university in Vietnam vied for top honors.
Understanding Cleaning Challenges for Automated Solder Paste Dispensing
09/18/2024 | Debbie Carboni, KYZENIn today’s rapidly evolving electronics manufacturing landscape, staying abreast of innovative technologies is crucial. As solder paste and substrate materials continually evolve and become more complex, optimizing production methods with the latest technology ensures performance and quality while reducing operational costs.
Successful Rehm Technology Days 2024 – Where the Future Meets Technology
09/17/2024 | Rehm Thermal SystemsTraditionally, the Rehm Technology Days offer a valuable opportunity for knowledge exchange, networking and discussion. Once again this year, numerous customers, partner companies, press representatives and employees from the worldwide locations met at the company headquarters in Blaubeuren-Seissen.
Circuit Technology Center Announces Expanded Tinning Services Capacity
09/16/2024 | Circuit Technology CenterCircuit Technology Center announces it has expanded its electronic component tinning services capacity. Four (4) Hentec-Odyssey 1325 robotic hot solder dip machines are in full operation to meet the increasing demand from the defense and high-reliability customer base that requires component tinning services for tin whisker mitigation, gold mitigation, and lead re-conditioning.
The Knowledge Base: The Pivotal Role of Solder Paste
09/16/2024 | Mike Konrad -- Column: The Knowledge BaseIn the complex world of electronics manufacturing, the humble solder paste plays a pivotal role. Often overshadowed by more conspicuous electronics assembly equipment and materials, this blend of powdered metal and flux is the unsung hero that binds the electronic circuits together. But beyond its adhesive and conductive properties, the selection of the right solder paste is crucial for ensuring the long-term reliability of electronic devices.