Atotech to Participate at the IEEE 72nd ECTC
May 24, 2022 | AtotechEstimated reading time: 1 minute

Atotech is looking forward to presenting at the IEEE 72nd Electronic Components and Technology Conference (ECTC). This international event organized by IEEE Electronics Packaging Society will take place in San Diego, California from Tuesday, May 31, to Friday, June 3, 2022.
We are excited to announce that Mr. Kuldip Johal, Global OEM Pathfinding Director will be part of the 2022 ECTC Special Session on “How will IC substrate technology evolve to enable next-generation heterogeneous integration schemes for high- performance applications?” on Tuesday, May 31 from 3:30 p.m. to 5:00 p.m. (PDT).
Additionally, our experts Dr. Britta Schafsteller, Global Product Manager Selective Finishing, and Dr. Tobias Bernhard, Senior Scientist Electronics R&D Desmear and Metallization, will present and share their expertise.
Date: Wednesday, June 1
Time: 2:20 – 2:45 p.m. (PDT)
“Impact of the final finish on the solder joint reliability and IMC
formation after thermal storage”
by Dr. Britta Schafsteller
Date: Friday, June 3
Time: 3:30 – 3:55 p.m. (PDT)
“Plating and recrystallization of galvanic Cu films on roll annealed and polycrystalline Cu foils and the effect of intermediate electroless Cu layers”
by Dr. Tobias Bernhard
Conference:
Electronic Components and Technology Conference (ECTC)
Date: May 31, to June 3, 2022
Booth: #514
Venue: The Sheraton San Diego Hotel and Marina 1380 Harbor Island Drive San Diego, CA 92101
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Absolute EMS: The Science of the Perfect Solder Joint
09/05/2025 | Absolute EMS, Inc.Absolute EMS, Inc., a six-time award-winning provider of fast turnaround, turnkey contract electronic manufacturing services (EMS), is drawing attention to the critical role of 3D Solder Paste Inspection (SPI) in ensuring the reliability of both FLEX and rigid printed circuit board assemblies (PCBAs).
Indium Corporation to Highlight High-Reliability Solder Solutions at SMTA Guadalajara Expo
09/04/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, will feature a range of innovative, high-reliability solder products for printed circuit board assembly (PCBA) at the SMTA Guadalajara Expo and Tech Forum, to be held September 17-18 in Guadalajara, Mexico.
Dr. Jennie Hwang to Present on ‘Solder Joint Reliability’ at SMTA International 2025
09/03/2025 | Dr. Jennie HwangDr. Jennie Hwang to address “Solder Joint Reliability” at the 2025 SMTA International Conference on Monday, October 20. Leveraging her decades of extensive real-world experiences and deep knowledge,
Indium to Highlight Energy-Efficient, High-Reliability Solder Solutions for EV and Electronics at Productronica India
09/03/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, electric vehicle (EV), thin-film, and thermal management markets, will feature a range of sustainable, high-reliability solder products at Productronica India, to be held September 17-19 in Bengaluru, India.
Altus Supports Datalink Electronics with Advanced Selective Soldering Solution to Boost Manufacturing Efficiency
09/02/2025 | Altus GroupDatalink Electronics has partnered with Altus Group to integrate a cutting-edge automated soldering solution, enhancing its production capabilities and reinforcing its strategic focus on quality, automation, and scalability.