Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

I-Connect007 Welcomes Dr. Cody Schoener as Newest Mil/Aero Columnist

11/09/2026 | I-Connect007
I-Connect007 is excited to welcome Dr. Cody Schoener of Dow as a new monthly columnist for our weekly Mil/Aero Newsletter. His column, Built to Survive, will explore the materials and technologies used to protect electronics in demanding military, aerospace, and aviation environments.

AT&S Goes Big at electronica 2026

11/09/2026 | AT&S
Penguin Solutions announced on November 4 that it had entered into a definitive agreement to sell its Cree LED business to private equity firm Transom Capital Group (Transom). 

Nordson EFD to Preview New Dispensing Technologies for Medical Device Assembly at COMPAMED 2026

11/06/2026 | Nordson
Nordson EFD, a Nordson company, announced that trade show attendees will get the first look at two new dispensing technologies, the Ultimus AccuFlow™ and PICO Pµlse® XP HV, at COMPAMED 2026, November 16–19 at the Düsseldorf Exhibition Centre in Düsseldorf, Germany.

When Does Reducing Silver Make Sense?

10/27/2026 | Senthil Kanagavel, MacDermid Alpha Electronics Solutions
There is a single decision at the center of every die-attach conversation right now that isn’t as much about chemistry as it is about control. This is most evident because silver prices have experienced significant volatility, evolving PFAS requirements are increasing regulatory and customer scrutiny, qualification windows are shrinking, and the packages that support AI, automotive, and power infrastructure must meet demanding performance and reliability requirements.

GlobalFoundries Unveils FD-SOI Platform for Physical AI

10/13/2026 | GlobalFoundries
GlobalFoundries (GF) unveiled plans for its new FDX Fusion™ FD-SOI platform, purpose-built for the evolving requirements of Physical AI.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in