It’s Only Common Sense: The Dangers of Staying Stagnant in a Changing World
Dan’s Biz Bookshelf: ‘Born to Create’
American Made Advocacy: The Administration Changed, but Our Industry’s Needs Remain
MacDermid Alpha Launches ALPHA HiTech AD13-9910B Ultra-Low Temperature Adhesive
August 11, 2022 | MacDermid Alpha Electronics SolutionsEstimated reading time: Less than a minute
MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions, announces the launch of ALPHA HiTech AD13-9910B ultra-low temperature adhesive, designed to mitigate defects on very temperature sensitive parts and substrates.
ALPHA HiTech AD13-9910B can be cured at temperatures as low as 60°C enabling excellent adhesion strength and a reduction in the defect rate on temperature sensitive parts. The product is suitable for plastic parts or substrates that are very sensitive to high temperature exposure and exhibits excellent adhesion strength on Stainless Steel (SUS), Nickel, PCBs and Liquid Crystal Polymer (LCP).
“ALPHA HiTech AD13-9910B ultra-low temperature adhesive is able to fast cure at very low temperatures, with excellent dispensing performance,” comments Jimmy Shu, Product Manager Adhesives and Encapsulants at MacDermid Alpha. “The product meets market reliability requirements such as adhesion strength in high temperatures and high humidity making it an excellent solution for camera module, optical and other applications that are very sensitive to high temperature exposure.”
For more information on ALPHA HiTech AD13-9910B and our range of ALPHA HiTech Low Temperature Adhesives please visit MacDermidAlpha.com.
Share on:
Suggested Items
PDR Offers Advanced Infrared Heating Technology for BGA Rework
12/02/2024 | PDRPDR Americas is proud to highlight its industry-leading solutions for BGA and SMT rework. As a trusted partner in electronics manufacturing, PDR’s rework stations deliver precision, reliability, and simplicity, setting a new standard for addressing the challenges of modern rework applications.
sureCore Now Licensing its CryoMem Range of IP for Quantum Computing
11/26/2024 | sureCoresureCore, the memory specialist, has announced that it is now licensing its CryoMem™ suite of Memory IP that is designed for use at the extremely low temperatures required for Quantum Computing (QC) applications.
Indium Technical Expert to Present at SiP Conference China
11/25/2024 | Indium CorporationIndium Corporation Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation on Low-Temperature Solder Material in Semiconductor Packaging Applications at SiP China Conference 2024 on November 27 in Suzhou, China.
DELO Introduces UV-approach for Fan-out Wafer-level Packaging
10/25/2024 | DELODELO has developed a new approach for fan-out wafer-level packaging (FOWLP). Its feasibility study shows: With the use of UV-curable molding materials instead of heat curing ones, warpage and die shift can be reduced significantly. Additionally, this leads to improvements in curing time and minimizes the energy consumption.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 4
10/03/2024 |Chapter 4 of this book addresses the challenges in ensuring high electrical reliability of low-temperature solder pastes in modern electronic assembly. Also covered is the need for new-generation materials due to advancements in technology. The authors also explore the impact of flux components on electrical reliability and the formulation considerations to achieve higher reliability.