The Marketing Minute: Marketing With Layers
The Right Approach: Electro-Tek—A Williams Family Legacy, Part 1
It’s Only Common Sense: If You’re Not Differentiated, You’re Dead
IPC Issues Call for Participation: Help Shape the Future of Design for Environment Standards
August 22, 2022 | IPCEstimated reading time: 1 minute
IPC’s Design for Excellence (DFX) guidelines document, IPC-2231 provides a framework to establish a design review process for the layout of printed board assemblies. This design review assesses the manufacturability attributes of printed boards, namely design for manufacturing, fabrication, assembly, testability, cost, reliability, environment, and reusability. IPC is aware of the responsibilities that electronics manufacturing companies will soon have to regulatory bodies around the world as well to the environment.
IPC’s 1-14 DFX Committee is actively reviewing IPC-2231A in order to revise it within the next two years. While a revision of the DFX guidelines document is IPC’s and the standards committee’s first priority, the team anticipates that they may be able to expand IPC eco-design activities to include the creation of a new eco-design for electronics guideline that provides a holistic coverage of circularity concepts and how they touch every step of the electronics manufacturing pipeline.
“We feel that this is an excellent opportunity to make a real difference in eco-design for circular electronics – but it all starts with the IPC-2231 DFX guidelines document,” said Patrick Crawford, IPC manager for design standards and related industry programs and IPC staff liaison to the 1-14 DFX Committee. “While IPC is determined to help electronics manufacturing companies become greener themselves, it will take continued input from industry through standards development activities through organizations like IPC, to produce meaningful change.”
Experts in green PCB design techniques, materials, manufacturing technologies, sourcing, policy, and regulation are invited to create the next standard for design for environment. If you have expertise or passion to create a greener future that benefits both industry and environment and want to contribute to establishing a best practice design methodology, please reach out to Patrick Crawford at PatrickCrawford@ipc.org.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
NOVOSENSE, UAES and Innoscience Advance Power Electronics for New Energy Vehicles
10/17/2025 | PRNewswireThe partnership focuses on developing next-generation intelligent integrated Gallium Nitride (GaN) products. Leveraging their combined expertise, the new devices will deliver more reliable GaN driving and protection features, enabling higher power density and paving the way for wider adoption in automotive systems.
Jabil Announces Board Transitions
10/17/2025 | JabilJabil Inc. announced that Executive Chairman of the Board of Directors Mark T. Mondello and Directors Kathleen A. Walters and Jamie Siminoff will not seek re-election at Jabil’s Annual Meeting of Stockholders in January 2026.
StenTech Strengthens Precision Parts Platform with AME Acquisition
10/17/2025 | StenTechStenTech, North America’s leading provider of SMT printing solutions and precision manufacturing, has announced the acquisition of Advanced Metal Etching, Inc. (AME), a recognized specialist in chemically etched and laser cut precision parts.
MKS’ Atotech, ESI to Participate in TPCA Show & IMPACT Conference 2025
10/17/2025 | MKS’ AtotechMKS Inc., a global provider of enabling technologies that transform our world, announced that its strategic brands Atotech (process chemicals, equipment, software, and services) and ESI (laser systems) will showcase their latest range of leading manufacturing solutions for printed circuit board (PCB) and package substrate manufacturing at the upcoming 26th TPCA Show 2025 to be held at the Taipei Nangang Exhibition Center from 22-24 October 2025.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.