Dan’s Biz Bookshelf: ‘The Future of Sales'
Driving Innovation: Traceability in PCB Production
It’s Only Common Sense: Price—Is That All You’ve Got?
iNEMI’s Call-for-Participation Webinar: PCB Characterization for CAF and ECM Failure Mitigation Project
August 31, 2022 | iNEMIEstimated reading time: 1 minute
CAF (conductive anodic filament) failures are an electrochemical migration (ECM) process that causes short circuits in PCBs. iNEMI’s Characterization for CAF and ECM Failure Mitigation project will assess several areas of concern related to CAF failure: (1) scaling and integration of laser and mechanical drill features, (2) incoming quality measures of glass/resin systems, and (3) manufacturing process factors that may limit future targets and demands. The project plans to:
- Lower design reliability risk through characterization and study of focused incoming material and process factors driving CAF.
- Enable pitch scaling and higher density board technologies and identify high risk PCB technology features.
- Develop a better understanding of CAF through hardware failure analysis and build awareness of failure mechanisms.
- Enable predictive methodologies for laser and mechanical drill features.
- Reduce product qualification costs and associated timescales.
Registration
Join our information webinar September 7 or 8 to learn more about this project and how it can benefit your company. Two sessions are scheduled (with the same content) and are open to industry. Advance registration is required. For additional information, visit iNEMI's website.
Session 1
Wednesday, September 7, 2022
8:00-9:00 a.m. PDT (US)
11:00 a.m.-12:00 p.m. EDT (US)
5:00-6:00 p.m. CEST (Europe)
Session 2
Thursday, September 8
7:00-8:00 a.m. CST (China)
4:00-5:00 p.m. PDT (US) on September 7
7:00-8:00 p.m. EDT (US) on September 7
Share on:
Suggested Items
E-tronix Announces Upcoming Webinar with ELMOTEC: Optimizing Soldering Quality and Efficiency with Robotic Automation
05/30/2025 | E-tronixE-tronix, a Stromberg Company, is excited to host an informative webinar presented by Raphael Luchs, CEO of ELMOTEC, titled "Optimize Soldering Quality and Efficiency with Robotic Automation," taking place on Wednesday, June 4, 2025 at 12:00 PM CDT.
SMTA Releases Final Batch of Training Resources Donated by Bob Willis
05/29/2025 | SMTAThe Surface Mount Technology Association (SMTA) announces the release of several more webinars, poster sets, and photo libraries to conclude a generous donation from renowned industry expert Bob Willis.
Driving Innovation: Traceability in PCB Production
05/29/2025 | Kurt Palmer -- Column: Driving InnovationTraceability across the entire printed circuit board production process is an increasingly important topic among established manufacturers and companies considering new PCB facilities. The reasons are apparent: Automatic loading of part programs, connection with MES systems and collection of production data, and compliance with Industry 4.0 requirements
ClassOne Technology, IBM Research Jointly Developing Non-NMP Solvent Processing for Semiconductor Manufacturing
05/26/2025 | ClassOne TechnologyClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, announced it has signed a joint development agreement with IBM Research focused on wet processing for advanced packaging.
KLA Invests in Operations in Wales with the Opening of a $138 Million R&D and Manufacturing Facility
05/23/2025 | PRNewswireKLA Corporation, a global leader in semiconductor process control and process-enabling technology, announced the opening of its new $138 million research and development (R&D) and manufacturing center in Newport, Wales, U.K., continuing the company's history of regional investment. SPTS, KLA's Wales-based product division, has been leading semiconductor equipment innovation in Wales since 1984, winning multiple Queen's Awards for excellence in R&D and export, and attracting strong technical talent to the region.