Saki to Showcase 3D AOI, SPI and AXI Solutions at NEPCON Vietnam 2022
September 8, 2022 | Saki CorporationEstimated reading time: 2 minutes

Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, is preparing to exhibit at NEPCON Vietnam 2022. From 14 to 16 September, visitors to the Saki booth #H01 will be invited to discover the latest 3D AOI, SPI and AXI inspection solutions alongside its 2D AOI benchtop model BF-Sirius. Together with our partner JS TECH, the Saki technology team will also present latest hard- and software innovations and demonstrate its Full SMT Line, Smart Factory and M2M capabilities.
Visitors to the Saki booth #H01 will be invited to take a first-hand look at the unique features of the latest hardware and software releases with an emphasis on accuracy, speed, reliability and full-line connectivity capability for applications across all sectors.
The show line-up on booth #H01 will feature:
3D-AOI
3D-AOI solution: 3Di-LS2 with 12?m high resolution Z-axis optical head control feature
The 3D AOI model 3Di-LS2 with 12?m camera head is designed to improve production, boost process efficiency, and maximize product quality. Equipped with Saki’s new Z-axis optical-head control feature, the machine’s advanced capabilities for accurate inspection of tall components, press-fit components and PCBAs in jigs will be a key highlight of the show. The innovative optical-head and side camera offers the industry’s highest level of inspection capability with a height-measurement range in 3D mode up to 40mm. The focus height in 2D is also increased to 40mm. With these capabilities, Saki’s 3Di-AOI Series fulfills inspection capabilities and flexibility far beyond standard SMT inspection processes with accuracy, speed, and ease.
3D-SPI
3Si-LD2 with 12?m camera head
Saki’s high-precision and high-speed 3D solder paste inspection machine is a dual-lane system equipped with a 12µm camera head for board sizes from 50mm x 60mm to 500mm x 510mm.
2D-AOI
BF-Sirius – Benchtop Solution for Large size PCB’s
BF-Sirius is a high-speed 2D AOI benchtop model that supports large size PCBs up to 500 x 460 mm (19.7? x 18.1?). The small footprint minimizes cost and floorspace requirements. The system can inspect multiple SMT processes including selective solder and conformal coating.
AXI
Visitors to the booth will also be offered an insight into Saki’s automated X-ray inspection systems that deploy unique Planar CT technology to provide high-speed and high-accuracy solutions for ‘Real 3D’ volumetric inspection. The systems clearly identify voids in the solder of BGAs mounted on boards and non-wetting shapes such as Head-In-Pillow caused by non-wetting of solder, as well as detecting defective parts.
“As one of the world’s top exporting countries of electronics, Vietnam is a key strategic region of focus for Saki,” said Eddie Ichiyama, Saki Chief Sales Manager Overseas. “We’re incredibly excited to be exhibiting again at NEPCON Vietnam after Covid 19 restrictions have finally lifted. We can’t wait to share our expertise and knowledge with the many visitors to the show.”
Suggested Items
Real Time with... IPC APEX EXPO 2025: New Dispensing and Coating Solutions from Rehm
04/03/2025 | Real Time with...IPC APEX EXPOMichael Hanke, Global Sales Officer at Rehm, discusses new dispensing and coating equipment developed in Germany. He emphasizes the significance of software integration with customer systems to tackle market challenges.
BEST Inc. Presents StencilQuik for Simplifying BGA Rework Challenges
04/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and rework tools is thrilled to announce StencilQuik™ rework stencils. This innovative product is specifically designed for placing Ball Grid Arrays (BGAs) or Chip Scale Packages (CSPs) during the rework process.
Real Time with... IPC APEX EXPO 2025: Nordson's Expansion of Intelligent Technologies
04/02/2025 | Real Time with...IPC APEX EXPOJonathia Ang-Mueller gives an update on Nordson's latest selective soldering system which features a small footprint, offering cost savings and increased production capacity. Advanced software allows for pre-sales simulations, enhancing customer engagement.
Knocking Down the Bone Pile: Basics of Component Lead Tinning
04/02/2025 | Nash Bell -- Column: Knocking Down the Bone PileThe component lead tinning process serves several critical functions, including removing gold plating, mitigation of tin whiskers, reconditioning of component solderability issues, and alloy conversion from lead-free (Pb-free) to tin-lead or from tin-lead to lead-free for RoHS compliance. We will cover each of these topics in more detail in upcoming columns.
Real Time with... IPC APEX EXPO 2025: Innovations at Indium Corporation—A Look into the Future
04/02/2025 | Real Time with...IPC APEX EXPOIndium Corporation, led by CEO Ross Berntson, is making strides in automotive applications with innovative solder paste technologies. The company prioritizes sustainability and energy efficiency in manufacturing while developing its workforce through partnerships with local universities.