-
-
News
News Highlights
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
LPKF ProtoLaser H4 Accelerates PCB Prototyping
September 12, 2022 | LPKFEstimated reading time: 1 minute

The ProtoLaser H4 has more than 45 years of experience in the mechanical processing of printed circuit boards and more than 30 years in laser processing. This experience is combined in the hardware and the LPKF CircuitPro system software included in the package. “The goal was a compact table-top system that would also convince the most demanding developers of electronics on different substrates. And it works,” says Lars Führmann, Sales Director LPKF DevelopmentQuipment with satisfaction. The new ProtoLaser is built on a granite base, has a powerful laser and a mechanical processing head that is operated independently from a tool magazine. During operation, laser safety class 1 applies - no special precautions are required.
With new tools, the production processes also change. With the ProtoLaser H4, the laser takes over the entire structuring of the fully coated circuit board materials. In this way, track/gap of 100 µm/50 µm can be reliably achieved. The drilling and cutting out of the circuit board or large breakthroughs is reserved for the mechanical tools. The ProtoLaser H4 integrates the tried-and-tested circuit board plotter into an innovative, high-precision system for laser micro-material processing.
A camera recognizes the exact position of the circuit board on the work table. This is how precise structuring of two-layer PCBs and single layers of multi-layers PCBs is possible. Flexible materials or foils are held securely in position with the integrated vacuum table.
The hardware achieves full performance with the easy-to-use system software. LPKF CircuitPro RP controls the entire production process - even for users without special expertise. Extensive libraries with material parameters, process flows for many common applications, a simple user interface and predefined laser tools simplify project planning. After loading the layout file, the software guides the user step by step through the production process. In-house prototyping significantly reduces the times of the individual design loops and is also suitable for small series.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Specially Developed for Laser Plastic Welding from LPKF
06/25/2025 | LPKFLPKF introduces TherMoPro, a thermographic analysis system specifically developed for laser plastic welding that transforms thermal data into concrete actionable insights. Through automated capture, evaluation, and interpretation of surface temperature patterns immediately after welding, the system provides unprecedented process transparency that correlates with product joining quality and long-term product stability.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
IBM, RIKEN Unveil First IBM Quantum System Two Outside of the U.S.
06/24/2025 | IBMIBM and RIKEN, a national research laboratory in Japan, today unveiled the first IBM Quantum System Two ever to be deployed outside of the United States and beyond an IBM Quantum Data Center.
Excellon Installs COBRA Hybrid Laser at Innovative Circuits
06/23/2025 | ExcellonExcellon is pleased to announce the successful installation of a second COBRA Hybrid Laser System at Innovative Circuits, located in Alpharetta, Georgia. The Excellon COBRA Hybrid Laser System uniquely combines both UV and CO₂ (IR) laser sources on a single platform—making it ideal for high-density prototype and production printed circuit boards (PCBs).