Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
Dan’s Biz Bookshelf: ‘Growth Hacker Marketing’
Happy’s Tech Talk #38: Novel Metallization for UHDI
LPKF ProtoLaser H4 Accelerates PCB Prototyping
September 12, 2022 | LPKFEstimated reading time: 1 minute
The ProtoLaser H4 has more than 45 years of experience in the mechanical processing of printed circuit boards and more than 30 years in laser processing. This experience is combined in the hardware and the LPKF CircuitPro system software included in the package. “The goal was a compact table-top system that would also convince the most demanding developers of electronics on different substrates. And it works,” says Lars Führmann, Sales Director LPKF DevelopmentQuipment with satisfaction. The new ProtoLaser is built on a granite base, has a powerful laser and a mechanical processing head that is operated independently from a tool magazine. During operation, laser safety class 1 applies - no special precautions are required.
With new tools, the production processes also change. With the ProtoLaser H4, the laser takes over the entire structuring of the fully coated circuit board materials. In this way, track/gap of 100 µm/50 µm can be reliably achieved. The drilling and cutting out of the circuit board or large breakthroughs is reserved for the mechanical tools. The ProtoLaser H4 integrates the tried-and-tested circuit board plotter into an innovative, high-precision system for laser micro-material processing.
A camera recognizes the exact position of the circuit board on the work table. This is how precise structuring of two-layer PCBs and single layers of multi-layers PCBs is possible. Flexible materials or foils are held securely in position with the integrated vacuum table.
The hardware achieves full performance with the easy-to-use system software. LPKF CircuitPro RP controls the entire production process - even for users without special expertise. Extensive libraries with material parameters, process flows for many common applications, a simple user interface and predefined laser tools simplify project planning. After loading the layout file, the software guides the user step by step through the production process. In-house prototyping significantly reduces the times of the individual design loops and is also suitable for small series.
Share on:
Suggested Items
AI Chips for the Data Center and Cloud Market Will Exceed US$400 Billion by 2030
05/09/2025 | IDTechExBy 2030, the new report "AI Chips for Data Centers and Cloud 2025-2035: Technologies, Market, Forecasts" from market intelligence firm IDTechEx forecasts that the deployment of AI data centers, commercialization of AI, and the increasing performance requirements from large AI models will perpetuate the already soaring market size of AI chips to over US$400 billion.
NXP Unveils Third-Generation Imaging Radar Processors for Level 2+ to 4 Autonomous Driving
05/09/2025 | NXP SemiconductorNXP Semiconductors N.V. unveiled its new S32R47 imaging radar processors in 16 nm FinFET technology, building on NXP’s proven expertise in the imaging radar space.
OSI Systems Receives $36 Million Contract for Aviation Security Systems
05/08/2025 | BUSINESS WIREOSI Systems, Inc. announced that its Security division received a contract award for approximately $36 million to deploy and service airport screening solutions for a prominent international airport in the Middle East.
Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems
05/08/2025 | Cadence Design SystemsAt its annual flagship user event, CadenceLIVE Silicon Valley 2025, Cadence announced a major expansion of its Cadence® Millennium™ Enterprise Platform with the introduction of the new Millennium M2000 Supercomputer featuring NVIDIA Blackwell systems, which delivers AI-accelerated simulation at unprecedented speed and scale across engineering and drug design workloads.
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.