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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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LPKF ProtoLaser H4 Accelerates PCB Prototyping
September 12, 2022 | LPKFEstimated reading time: 1 minute
The ProtoLaser H4 has more than 45 years of experience in the mechanical processing of printed circuit boards and more than 30 years in laser processing. This experience is combined in the hardware and the LPKF CircuitPro system software included in the package. “The goal was a compact table-top system that would also convince the most demanding developers of electronics on different substrates. And it works,” says Lars Führmann, Sales Director LPKF DevelopmentQuipment with satisfaction. The new ProtoLaser is built on a granite base, has a powerful laser and a mechanical processing head that is operated independently from a tool magazine. During operation, laser safety class 1 applies - no special precautions are required.
With new tools, the production processes also change. With the ProtoLaser H4, the laser takes over the entire structuring of the fully coated circuit board materials. In this way, track/gap of 100 µm/50 µm can be reliably achieved. The drilling and cutting out of the circuit board or large breakthroughs is reserved for the mechanical tools. The ProtoLaser H4 integrates the tried-and-tested circuit board plotter into an innovative, high-precision system for laser micro-material processing.
A camera recognizes the exact position of the circuit board on the work table. This is how precise structuring of two-layer PCBs and single layers of multi-layers PCBs is possible. Flexible materials or foils are held securely in position with the integrated vacuum table.
The hardware achieves full performance with the easy-to-use system software. LPKF CircuitPro RP controls the entire production process - even for users without special expertise. Extensive libraries with material parameters, process flows for many common applications, a simple user interface and predefined laser tools simplify project planning. After loading the layout file, the software guides the user step by step through the production process. In-house prototyping significantly reduces the times of the individual design loops and is also suitable for small series.
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Rachael Temple - AlltematedSuggested Items
Remtec to Showcase Advanced Ceramic Technologies and Present Thermal Management for High-Power Applications at CMSE 2026
04/23/2026 | RemtecRemtec, a global leader in advanced ceramic substrates and microelectronic assembly solutions, today announced that President and CEO Brian Buyea will lead the company’s participation at Components for Military & Space Electronics Conference & Exhibition (CMSE 2026).
Smart Automation: The Journey of a Component Through an SMT Factory
04/22/2026 | Josh Casper -- Column: Smart AutomationIn electronics manufacturing, the SMT line tends to get most of the attention. Placement machines, inspection systems, screen printers, and reflow ovens often take center stage when discussing productivity improvements or new equipment investments. While these systems are obviously critical to the manufacturing process, they only represent a portion of the journey every component takes before becoming part of a finished assembly.
Webinar Review, Part 2: Building the AI Backbone at IBM on Systems-level Packaging
04/20/2026 | Marcy LaRont, I-Connect007The second presentation in a recent Global Electronics Association’s Executive Pulse webinar series widened the lens on advanced packaging, moving beyond the component level to a systems-level view of how AI is reshaping the electronics landscape. Building on Dr. Hemanth Dhavaleswarupu of AMD’s previous discussion of chip-level packaging innovation, Dr. Jung Yoon of IBM explored the broader infrastructure implications, from the data center floor to the global supply chain.
Cadence, NVIDIA Expand AI & Accelerated Computing Partnership
04/17/2026 | Cadence Design Systems, Inc.At CadenceLIVE Silicon Valley 2026, Cadence announced an expanded partnership with NVIDIA to deliver accelerated solutions across agentic AI, physics-based simulation and digital twins to unlock new levels of productivity and accelerate next‑generation engineering design flows across semiconductor design, physical AI systems and hyperscale AI factories.
Below the Surface: Looking Ahead to Where Integration Actually Happens
04/20/2026 | Chandra Gupta -- Column: Below the SurfaceProgress in RF rarely arrives and suddenly rewrites the rules. What actually moves performance forward almost always happens in the seams, the interfaces, the choices that determine whether individual parts are allowed to work together, or forced to fight one another. So, when we look ahead in RF systems—from DC through millimeter-wave—the most important conversations aren’t about isolated materials or heroic devices. They’re about integration, and more specifically, about how ceramic-based RF packages and module architectures shape system-level behavior long before the signal ever reaches free space.