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Averatek to Present Paper on 'Thermal Stress Reliability of Novel Process' at IPC APEX EXPO 2023
January 23, 2023 | AveratekEstimated reading time: 1 minute

Averatek is pleased to announce that Director of Advanced Process Development Gus Karavakis will present “Thermal Stress Reliability of Stacked Microvias Fabricated with a Liquid Metal Ink Semi-Additive Process” at the IPC APEX Expo Technical Conference, January 24-26, 2023 in the San Diego Convention Center. The technical paper was co-authored by Mike Carano, IPC Technology Roadmap Committee Chair and member of the Board of Directors.
The drive to miniaturization makes the smaller footprint of stacked vias more desirable in terms of routing and design efficiency than staggered vias. However, there is evidence that stacked vias are prone to latent failures after exposure to thermal stress of conventional surface mount technology (SMT) reflow processes. This issue is broadly defined as a weak interface between the plated copper and the blind via target pad. When thermally stressed, the generally weak interface will fracture, especially during forced-convection assembly reflow.
While many studies of microvia interfacial fracture focused on conventional electroless copper as the plated through-hole (PTH) choice, no recent studies measured the reliability of stacked microvias with a semi-additive process (SAP) using a liquid metal ink as the catalytic layer.
This novel catalytic ink promotes a tightly adherent and ultrathin electroless copper deposit. The lower thickness enables much finer line spaces and trace widths than conventional subtractive-etch or modified semi-additive processes (mSAP). Liquid metal ink technology enables capability for 5micron lines and spaces; the tighter line width control will benefit the impedance control.
To measure reliability of the liquid metal ink process, test vehicles were constructed and subjected to Thermal Shock and Thermal Stress testing, according to protocols in IPC-TM-650 Test Method 2.6.27B. Complete results of this study will be covered in the presentation.
Test results indicate that the liquid metal ink process provides long-term reliability on two-stack blind vias, while offering distinct functionality advantages beyond conventional subtractive and mSAP processes.
Gus Karavakis has over 30 years of industry experience, with special expertise in advanced processes, additive technologies, IC Packaging and substrates, flex and rigid-flex PCB manufacturing and materials. He is the author/co-author of more than 80 patents, and holds a BE in Chemical Engineering from CCNY with an MS in Chemical Engineering from Columbia University.
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OKI Launches Rigid-Flex PCBs with Embedded Copper Coins Featuring Improved Heat Dissipation for Space Equipment Applications
07/29/2025 | BUSINESS WIREOKI Circuit Technology, the OKI Group’s printed circuit board (PCB) business company, has developed rigid-flex PCBs with embedded copper coins that offer improved heat dissipation for use in rockets and satellite-mounted equipment operating in vacuum environments.
Designers Notebook: Basic PCB Planning Criteria—Establishing Design Constraints
07/22/2025 | Vern Solberg -- Column: Designer's NotebookPrinted circuit board development flows more smoothly when all critical issues are predefined and understood from the start. As a basic planning strategy, the designer must first consider the product performance criteria, then determine the specific industry standards or specifications that the product must meet. Planning also includes a review of all significant issues that may affect the product’s manufacture, performance, reliability, overall quality, and safety.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/18/2025 | Nolan Johnson, I-Connect007It may be the middle of the summer, but the news doesn’t quit, and there’s plenty to talk about this week, whether you’re talking technical or on a global scale. When I have to choose six items instead of my regular five, you know it’s good. I start by highlighting my interview with Martyn Gaudion on his latest book, share some concerning tariff news, follow that up with some promising (and not-so-promising) investments, and feature a paper from last January’s inaugural Pan-European Design Conference.
Elephantech Launches World’s Smallest-Class Copper Nanofiller
07/17/2025 | ElephantechJapanese deep-tech startup Elephantech has launched its cutting-edge 15 nm class copper nanofiller – the smallest class available globally. This breakthrough makes Elephantech one of the first companies in the world to provide such advanced material for commercial use.
Copper Price Surge Raises Alarms for Electronics
07/15/2025 | Global Electronics Association Advocacy and Government Relations TeamThe copper market is experiencing major turbulence in the wake of U.S. President Donald Trump’s announcement of a 50% tariff on imported copper effective Aug. 1. Recent news reports, including from the New York Times, sent U.S. copper futures soaring to record highs, climbing nearly 13% in a single day as manufacturers braced for supply shocks and surging costs.