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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Industry Advances in a New Era at IPC APEX EXPO 2023
February 8, 2023 | IPCEstimated reading time: 3 minutes
From the show floor – where 375 exhibitors displayed a multitude of high-tech machinery and in some cases artificial intelligence – including cutting-edge assembly, testing and inspection equipment, software automation, laser systems, additive manufacturing and factory of the future technologies, to dozens of technical conference sessions and PD courses covering such hot-topic tracks as smart factories, PCB fabrication and materials and high-density interconnects, IPC APEX EXPO 2023 was fueled by the possibilities of new advances in electronics manufacturing.
2023 ushered in a re-invigorated group of attendees and exhibitor personnel, drawing in a total number of 6,901 participants.
In keeping with the event’s theme, “Advance in a New Era,” the IPC APEX EXPO Technical Program Committee built a strong program with five tracks, 28 sessions and 104 papers, with peer-reviewed content from 18 countries, detailing original research and innovations from industry experts around the world. “From attendees, I was pleased to hear accolades on technical program offerings, many stating that it was the best conference in years – attendance was at an all-time high in more than a decade,” said IPC President and CEO John W. Mitchell. “The paper presenters, international subject matter experts, eagerly shared their knowledge and expertise and provided attendees with quality technical content not found or presented anywhere else. We are very proud of the technical conference and set the bar high for paper submissions. New this year were two special technical sessions, one on advanced packaging presented by IPC’s Chief Technical Officer Matt Kelly and another on e-Mobility lead by Brian O’Leary, Indium and Jason Schwartz, KYZEN. Both special sessions drew capacity crowds and earned high marks from attendees for their thoroughness of content.” Mitchell added.
More than 100 standards development committees and task groups made significant progress on new and revised documents covering such topics as design, materials, board fabrication, cleaning, coating, assembly, cables and harnesses, printed electronics, connected factory, e-textiles, and more. “Task group meetings began on the weekend prior to official start of the show, and what a weekend it was during back-to-back full-day sessions! With a record crowd of 175 participants, the 5-22a and 7-31b task groups combined their meetings to work on comment resolution for new revisions of J-STD-001 and IPC-A-610,” said Teresa Rowe, IPC senior director, assembly and standards technology.
From survey responses, the APEX EXPO 2023 experience was resoundingly positive for exhibitors. “IPC APEX 2023 was a big hit for us – the best show in years! Our booth was consistently packed with every demo station in use by customers,” said Davina McDonnell, global marketing manager, Cogiscan. “Our team had meaningful and productive conversations with lots of new contacts and we all left the show energized and excited about what’s in store for the rest of the year. This was the best IPC APEX EXPO we have participated in,” McDonnell added.
Added John Lee, vice president of marketing and brand strategy, Insulectro, “I extend my congratulations to IPC for a superb IPC APEX EXPO 2023. I applaud the association on its continued drive to improve, enhance, and spotlight things that matter to our industry. Insulectro had a super experience as well — our best exhibiting experience ever!”
Summing up IPC APEX EXPO 2023, Mitchell added, “IPC APEX EPXO is a gathering place for the present and future of electronics, enabling all of us to connect in remarkable ways. We at IPC are profoundly grateful to an industry that has encouraged and supported us in producing IPC APEX EXPO. We never lose sight of the fact that we could not host this event without the dedicated volunteers who share their time, their expertise, and their enthusiasm with all of us. Though IPC APEX EXPO 2023 is in our rear-view mirror, our dedicated events, education, technical, membership, and marketing and sales teams are already preparing for next year’s event which will take place April 6-11, 2024, in Anaheim, California.”
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Rachael Temple - AlltematedSuggested Items
TTC-LLC and TTCI: Smarter Training, Stronger Test at PCB East 2026
04/27/2026 | The Test Connection Inc.The Training Connection LLC (TTC-LLC) and The Test Connection, Inc. (TTCI) will be exhibiting together at PCB East 2026, taking place April 28–May 1 at the DCU Convention Center in Worcester, Massachusetts. Attendees can find both teams at Booth #103 during the main exhibition day on Wednesday, April 29.
Building Industry-ready Talent Through Standards-based Education
04/27/2026 | Global Electronics AssociationRecently, Sichuan Modern Vocational College organized 132 students to complete IPC-A-610 Acceptability of Electronic Assemblies Certified IPC Specialist (CIS) training and certification.
Roundtable: Data Protection Lays the Groundwork for Cybersecurity Strategies
04/27/2026 | Nolan Johnson, I-Connect007This multi-expert roundtable explores cybersecurity measures specific to electronics manufacturing. NEC’s Watanabe Hiroyaki, Divyash Patel, CEO of MX2 Technologies, and Ali Pabrai, CEO at EC First, join moderator Nolan Johnson for a deeper discussion on cybersecurity certifications.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.
The Right Approach: The End of an Era—DoD Proposes MIL-PRF-31032 Cancellation
04/21/2026 | Steve Williams -- Column: The Right ApproachThe Defense Logistics Agency has initiated formal proceedings to cancel the military's primary performance specification for printed circuit boards, a move that could reshape how the U.S. defense industrial base qualifies and sources one of its most critical electronic components. On March 4, 2026, DLA Weapons Support issued a memorandum to military and industry coordination activities announcing that MIL-PRF-31032, along with its six associated specification sheets, has been proposed for cancellation. A 30-day comment period was allotted, with concurrence or comments due by April 3, 2026.