-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueIt's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
Fueling the Workforce Pipeline
We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
Inner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Industry Advances in a New Era at IPC APEX EXPO 2023
February 8, 2023 | IPCEstimated reading time: 3 minutes

From the show floor – where 375 exhibitors displayed a multitude of high-tech machinery and in some cases artificial intelligence – including cutting-edge assembly, testing and inspection equipment, software automation, laser systems, additive manufacturing and factory of the future technologies, to dozens of technical conference sessions and PD courses covering such hot-topic tracks as smart factories, PCB fabrication and materials and high-density interconnects, IPC APEX EXPO 2023 was fueled by the possibilities of new advances in electronics manufacturing.
2023 ushered in a re-invigorated group of attendees and exhibitor personnel, drawing in a total number of 6,901 participants.
In keeping with the event’s theme, “Advance in a New Era,” the IPC APEX EXPO Technical Program Committee built a strong program with five tracks, 28 sessions and 104 papers, with peer-reviewed content from 18 countries, detailing original research and innovations from industry experts around the world. “From attendees, I was pleased to hear accolades on technical program offerings, many stating that it was the best conference in years – attendance was at an all-time high in more than a decade,” said IPC President and CEO John W. Mitchell. “The paper presenters, international subject matter experts, eagerly shared their knowledge and expertise and provided attendees with quality technical content not found or presented anywhere else. We are very proud of the technical conference and set the bar high for paper submissions. New this year were two special technical sessions, one on advanced packaging presented by IPC’s Chief Technical Officer Matt Kelly and another on e-Mobility lead by Brian O’Leary, Indium and Jason Schwartz, KYZEN. Both special sessions drew capacity crowds and earned high marks from attendees for their thoroughness of content.” Mitchell added.
More than 100 standards development committees and task groups made significant progress on new and revised documents covering such topics as design, materials, board fabrication, cleaning, coating, assembly, cables and harnesses, printed electronics, connected factory, e-textiles, and more. “Task group meetings began on the weekend prior to official start of the show, and what a weekend it was during back-to-back full-day sessions! With a record crowd of 175 participants, the 5-22a and 7-31b task groups combined their meetings to work on comment resolution for new revisions of J-STD-001 and IPC-A-610,” said Teresa Rowe, IPC senior director, assembly and standards technology.
From survey responses, the APEX EXPO 2023 experience was resoundingly positive for exhibitors. “IPC APEX 2023 was a big hit for us – the best show in years! Our booth was consistently packed with every demo station in use by customers,” said Davina McDonnell, global marketing manager, Cogiscan. “Our team had meaningful and productive conversations with lots of new contacts and we all left the show energized and excited about what’s in store for the rest of the year. This was the best IPC APEX EXPO we have participated in,” McDonnell added.
Added John Lee, vice president of marketing and brand strategy, Insulectro, “I extend my congratulations to IPC for a superb IPC APEX EXPO 2023. I applaud the association on its continued drive to improve, enhance, and spotlight things that matter to our industry. Insulectro had a super experience as well — our best exhibiting experience ever!”
Summing up IPC APEX EXPO 2023, Mitchell added, “IPC APEX EPXO is a gathering place for the present and future of electronics, enabling all of us to connect in remarkable ways. We at IPC are profoundly grateful to an industry that has encouraged and supported us in producing IPC APEX EXPO. We never lose sight of the fact that we could not host this event without the dedicated volunteers who share their time, their expertise, and their enthusiasm with all of us. Though IPC APEX EXPO 2023 is in our rear-view mirror, our dedicated events, education, technical, membership, and marketing and sales teams are already preparing for next year’s event which will take place April 6-11, 2024, in Anaheim, California.”
Suggested Items
IPC Hall of Fame Spotlight Series: Highlighting Denny Fritz
03/13/2025 | Dan Feinberg, I-Connect007This month, the Hall of Fame spotlight features Denny Fritz, a long-time friend and associate of mine. Denny first got involved with IPC in 1978 while working with MacDermid. His first efforts were with the various board fabrication committees, something he believes helped lead to his eventual Hall of Fame award.
IPC Asia’s Talent Development Program Opens Pathways to a More Qualified Workforce
03/14/2025 | Evelyn Cui, IPC AsiaIn Asia, the contradiction between the rapid development of the electronics manufacturing industry and the shortage of talent is particularly evident. The existing talent pool cannot fully meet the market's demand for highly skilled professionals. According to feedback from industry companies, there is an urgent need for professionals with knowledge of IPC standards and practical skills in electronics. However, the reality is that most academic courses are disconnected from the actual needs of the industry, leading to disappointing results when companies recruit from universities and schools.
Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI
03/12/2025 | Ventec International GroupVentec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.
IPC Releases Latest List of Standards and Revisions
03/12/2025 | IPCEach quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q1 2025.
The Test Connection Inc. Promotes Melanie Rutkauskas to Director of Operations for The Training Connection, LLC
03/11/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is pleased to announce the promotion of Melanie Rutkauskas to Director of Operations for The Training Connection, LLC (TTC-LLC). With her extensive background in operations management, accounting, and customer relations, Melanie brings a wealth of experience and leadership to her new role.