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Production Begins at SEL’s $100M Printed Circuit Board Facility
February 27, 2023 | Schweitzer Engineering LaboratoriesEstimated reading time: 2 minutes
Schweitzer Engineering Laboratories will officially begin fabricating printed circuit boards in its new, state-of-the-art facility in Moscow, Idaho, next week.
The 162,000-square-foot facility, which the company began constructing in spring 2021, will house the operation to fabricate the printed circuit boards used in its products that protect, monitor, control and automate electric power systems around the world. SEL manufactures its electronic devices in Pullman, Washington; Lewiston, Idaho; Lake Zurich, Illinois; and West Lafayette, Indiana.
“SEL folks with many different backgrounds, educations, interests and experience teamed up to conceive, design, build and produce these essential components of our products—all on our own dime without any government handouts or subsidies,” said President and Chief Technology Officer Edmund O. Schweitzer, III. “We committed to each other to do it right, and now we are safely producing the highest-quality boards in the cleanest plant, using the least amount of resources that science and engineering afford us today. This is $100M of employee owners’ money well spent on creating our future right here at home. I’m proud of our entire team and grateful for the economic and political freedom we enjoy in America.”
SEL has designed a highly automated and environmentally friendly process for manufacturing printed circuit boards that is focused on the health and safety of the community. The facility features zero-discharge water recycling and air filtration technology.
“We went into this not only thinking like a manufacturer but also like community members,” said Senior Director of Vertical Integration Jessi Hall. “So much research, learning and testing has gone into designing our fabrication processes and selecting the best equipment and tools for the job. We are excited to see everything come together and to really start realizing the benefits of these investments.”
The company will employ about 60 people in the facility. The positions range from a variety of engineering roles, including chemical, mechanical, software and computer-aided manufacturing to equipment operators and maintenance workers.
The printed circuit board process begins by layering fiberglass and copper to create a rigid and conductive base. The base board is then sent through a series of automated processes that include drilling, layering, copper plating and etching. The finished boards serve as the foundation of our manufacturing process, where integrated circuits and other electrical components are mounted to the board. Ultimately, the boards and added components serve as the information centers for our SEL products.
The SEL property team served as the contractor for the construction project and partnered with multiple companies local to the Pacific Northwest. The team was able to complete the project within the expected timeline despite global supply chain challenges.
“I am so proud of SEL’s partnership with dedicated subcontractors to find solutions when materials became scarce and timelines unwieldy,” said Vice President of Property Jana Schultheis. “Our construction teams are second to none. It is a proud day to see this factory come online as a result of their ingenuity.”
SEL plans to host a grand opening for the facility later in the year.
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Driving Innovation: Selecting the Right Laser Source
04/28/2026 | Simon Khesin -- Column: Driving InnovationWhen I first joined Schmoll Maschinen, I brought experience from almost every PCB process, except for laser. As I immersed myself in laser processing, I realized why it can seem so daunting to a newcomer. The complexity arises from three intersecting factors: A vast variety of laser sources: CO2, UV-nano, green-pico, UV-pico, IR-pico, and others; a diverse range of applications: Drilling, cutting, ablation, and more; and an extensive list of materials: These have vastly different absorption rates. Choosing the right machine or laser source is rarely trivial. Even for experienced engineers, answering "Which source is best?" requires examining the business's specific goals.
Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
04/23/2026 | Pete Starkey, I-Connect007Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.
Advanced Packaging for AI: Reliability Starts at the Cu/Cu/Cu Microvia Junction
04/20/2026 | Kuldip Johal, MKS' AtotechThe rapid growth of AI computing, from training clusters to inference at scale, is reshaping demand across the entire electronics supply chain. Advances in technology requirements, such as higher bandwidth, lower latency, and greater compute density, are driving the development of advanced packaging technologies and transforming the PCB industry across design, manufacturing, testing, and even architecture.