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Rogers Features Advanced Materials Technology, Capabilities for Defense Electronic Systems at GOMACTech 2023
March 13, 2023 | Rogers CorporationEstimated reading time: 1 minute
Rogers Corporation will exhibit at the GOMACTech 2023 conference at Town & Country in San Diego, CA (Booth #509), March 21—22, highlighting laminate and film materials for use in the advanced packaging industry, used in C4ISR applications in the Ground, Air, Sea and Space domains.
GOMACTech is a premier event focused on developments in microcircuit applications for government systems.
Some of Rogers’ products being highlighted include:
Recently introduced Radix 3D Printable Dielectrics family of products, is the first available material featuring a dielectric constant of 2.8 and low loss characteristics at microwave frequencies. These printable dielectric materials give radio frequency (RF) designers unprecedented design freedom in creating new components, eliminating the need to consider typical manufacturing design constraints.
Radix3D Printable Dielectrics are proprietary composite materials designed for Digital Light Processing (DLP) 3D printing, enabling a scalable, high-resolution printing process for end-use RF dielectric component manufacturing. Rogers Corporation’s first Radix 3D Printable Dielectric material has a targeted dielectric constant of 2.8 and a dissipation factor of 0.0043 at 10 GHz when cured.
MAGTREX 555 High Impedance Laminates: The first commercially available low loss laminate with controlled permeability and permittivity, enabling antenna designers to expand the trade-space of their antenna design, enabling design flexibility and optimization.
Rogers technical staff will be available to discuss your most demanding applications from Build-Up materials for advanced packaging solutions, Phase Array Radar solutions, high frequency magneto-dielectric materials, ablative Radome materials, and metallized-shaped/3D ADM dielectric solutions.
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KYZEN to Spotlight KYZEN E5631, AQUANOX A4618 and Process Control at SMTA Silicon Valley Expo and Tech Forum
11/21/2024 | KYZEN'KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Silicon Valley Expo & Tech Forum on Thursday, December 5, 2024 at the Fremont Marriott Silicon Valley in Fremont, CA.
Flexible Thinking: Rules of Thumb: A Word to the Wise
11/20/2024 | Joe Fjelstad -- Column: Flexible ThinkingIn the early days of electronics manufacturing—especially with PCBs—there were no rules. Engineers, scientists, and technicians largely felt their way around in the dark, making things up as they went along. There was a great deal of innovation, guessing, and testing to make sure that early guidelines and estimates were correct by testing them. Still, they frequently made mistakes.
Cadence Unveils Arm-Based System Chiplet
11/20/2024 | Cadence Design SystemsCadence has announced a groundbreaking achievement with the development and successful tapeout of its first Arm-based system chiplet. This innovation marks a pivotal advancement in chiplet technology, showcasing Cadence's commitment to driving industry-leading solutions through its chiplet architecture and framework.
CHIPS for America Announces New Proposed $285 Million Award for CHIPS Manufacturing USA Institute for Digital Twins
11/19/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) are entering negotiations for the Department to provide SRC $285 million to establish and operate a Manufacturing USA institute headquartered in Durham, North Carolina.
PCB Carolina’s Formula: Industry Experts and Catered Food
11/18/2024 | Andy Shaughnessy, Design007 MagazinePCB Carolina organizers at the Better Boards design bureau seem to have found the perfect formula: Industry experts plus catered food equals a constantly expanding show. This one-day tabletop show has been growing for two decades, and that trendline continued with this year’s event on November 13.