American Made Advocacy: Smart Policies Can Ensure AI Data Centers Are Secure
Beyond the Board: Early Engagement Means Faster Prototyping for Defense Programs
Defense Speak Interpreted: The Autonomous Plane Battle—Skyborg Vs. Loyal Wingman
Ansys Joins TSMC's OIP Cloud Alliance for Secure Multiphysics Analysis in the Cloud
April 27, 2023 | ANSYSEstimated reading time: 1 minute
Ansys announced that it has joined TSMC's OIP Cloud Alliance to facilitate the deployment of fully distributed workflows for mutual customers. By driving toward the cloud interoperability of Ansys multiphysics solutions with TSMC's technology enablement, customers will easily be able to gain the full benefits of faster run times and elastic computing with major cloud vendors.
Combining EDA parallelism and cloud scalability, TSMC and its OIP Cloud Alliance partners are creating next-generation, cloud-optimized design methodologies to further accelerate turnaround time of critical design tasks. Ansys and other EDA partners will optimize their tools for multi-threaded, fully-distributed runs to best utilize cloud, while cloud partners will bring new virtual machines most suitable for the EDA workload of IC designs.
"Our customers of all sizes are leveraging the cloud to boost productivity while designing in TSMC's leading-edge technologies for new applications from high performance computing to mobile, artificial intelligence, networking, and 3D-IC," said Dan Kochpatcharin, head of the Design Infrastructure Management Division at TSMC. "By welcoming Ansys as the latest member into our OIP Cloud Alliance, TSMC aims to make Ansys' leading multiphysics signoff solutions available to all of our customers and help them bring their differentiated products to market sooner, with higher quality."
Ansys was an early adopter of elastic cloud computing with its SeaScape big-data platform – a cloud-native data infrastructure that was designed specifically for EDA. Ansys® RedHawk-SC™ was the first tool built to work with SeaScape (SC) and many other Ansys semiconductor tools have followed, including Ansys® PathFinder-SC™, Ansys® Totem-SC™, and Ansys® PowerArtist-SC™.
"Ansys' strategy for the future foresees an absolutely central role for cloud computing," said John Lee, vice president and general manager of the semiconductor, electronics, and optics business unit at Ansys. "We have invested heavily in cloud-enabled platforms that give our products clear advantages in speed and capacity over traditional tool environments that were not designed for the cloud."
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Everyone’s Talking About Power
11/06/2025 | Heidi Barnes, Keysight TechnologiesDelivering power to a digital load is an AC function, not DC. That simple statement may be obvious, but the implications of how electricity travels to an electronic load are complicated. Dynamic loads with rapidly changing currents create electric and magnetic fields that adhere to Maxwell’s equations. Ground can be misleading and is probably better used for describing where one grows potatoes and carrots. Electrical currents have “return paths,” and the energy is traveling in the fields between the power rail and the return path.
New Podcast Episode: “Bonding Innovation: How Adhesives and Coatings Are Powering the Next Generation of Electronics”
11/05/2025 | I-Connect007I-Connect007 has released of a new episode in its Voices of the Industry podcast series, titled “Bonding Innovation: How Adhesives and Coatings Are Powering the Next Generation of Electronics.” Hosted by Nolan Johnson, this insightful discussion dives deep into the evolving world of adhesives and coatings—materials that are redefining performance, reliability, and design in modern electronics manufacturing. Dymax's Doug Katze, a leading expert in adhesive technologies, delivers what can only be described as a master class on how these critical materials are adapting to meet rapidly changing market demands.
Target Condition: Distribution of Power—Denounce the Ounce
11/05/2025 | Kelly Dack -- Column: Target ConditionHave you ever wondered why the PCB design segment uses ounces to describe copper thickness? There’s a story behind all of this—a story that’s old, dusty, and more than a little absurd. (Note that I didn’t add “Like many of us.”) Legend has it that back in the days of copper tinkers and roofing tradesmen, the standard was set when a craftsman hammered out a sheet of copper until it weighed one ounce, when its area conveniently matched the square of the king’s foot.
NEDME 2025 Draws Strong Northwest Crowd, Builds on Tradition of Regional Collaboration
10/31/2025 | NEDMEThe NW Electronics Design & Manufacturing Expo (NEDME) 2025 once again brought together the Pacific Northwest community for a full day of learning, networking, and industry connections.
Keysight Advances Quantum Engineering with New System-Level Simulation Solution
10/30/2025 | BUSINESS WIREKeysight Technologies, Inc. announced the release of Quantum System Analysis, a breakthrough Electronic Design Automation (EDA) solution that enables quantum engineers to simulate and optimize quantum systems at the system level.