Lithium Prices Rebound, China’s Battery Industry Chain Expected to Recover in May, Says TrendForce
May 10, 2023 | TrendForceEstimated reading time: 1 minute

The ASP of battery-grade lithium carbonate and lithium hydroxide in China saw an MoM decline in the month of April, falling to CNY 198,000/ton (-39%) and CNY 266,000/ton (-33%), respectively, according to TrendForce research. Although the MoM decline in prices has expanded, lithium salt prices began to show signs of stabilization and rebounded in late April. Additionally, prices of lithium hexafluorophosphate (LiPF6)—a key raw material used in electrolytes— have recently started to rise again, prices of anode materials, iron phosphate, and lithium battery copper foil have almost bottomed out, and China’s EV battery industry chain is gradually stabilizing.
Lithium salt prices experienced a five-month decline before stabilizing and rebounding in April. This allowed the prices of various li-ion battery products to return to levels observed prior to the surge in demand at the end of 2021. Specifically, in April, the ASP of EV square ternary cells, LFP cells, and pouch ternary power cells were CNY 0.83/Wh, CNY 0.74/Wh, and CNY 0.87/Wh, respectively. Taking a look at battery cells used in energy storage equipment, lithium iron phosphate (LFP) storage cells declined 10.5% MoM in April to around CNY 0.74/Wh. However, the price of LFP materials has recently begun to rise, and businesses are receiving more orders. As for battery cells used in consumer electronics, the ASP of cobalt lithium (LCO) cells in April was CNY 8.54/Ah (USD 1.24)—a 9% MoM decline—and the market has been showing signs of recovery.
TrendForce observes that Chinese EV battery manufacturers are nearing the end of their inventory reduction efforts, and the relationship between supply and demand has gradually normalized after more than a quarter period of market adjustments. Furthermore, current battery material prices are stabilizing and market demand is steadily increasing, indicating that China’s battery industry chain is gradually recovering. Total recovery is expected in June as downstream demand continues to pick up.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Statement from the Global Electronics Association on the July 2025 Tariff on Copper Foil and Electronics-Grade Copper Inputs
07/31/2025 | Global Electronics AssociationWe are disappointed by today’s decision to impose a 50% tariff on imported copper foil and other essential materials critical to electronics manufacturing in the United States.
Trouble in Your Tank: Metallizing Flexible Circuit Materials—Mitigating Deposit Stress
08/04/2025 | Michael Carano -- Column: Trouble in Your TankMetallizing materials, such as polyimide used for flexible circuitry and high-reliability multilayer printed wiring boards, provide a significant challenge for process engineers. Conventional electroless copper systems often require pre-treatments with hazardous chemicals or have a small process window to achieve uniform coverage without blistering. It all boils down to enhancing the adhesion of the thin film of electroless copper to these smooth surfaces.
Considering the Future of Impending Copper Tariffs
07/30/2025 | I-Connect007 Editorial TeamThe Global Electronics Association is alerting industry members that a potential 50% tariff on copper could hit U.S. electronics manufacturers where it hurts.
Connect the Dots: Sequential Lamination in HDI PCB Manufacturing
07/31/2025 | Matt Stevenson -- Column: Connect the DotsAs HDI technology becomes mainstream in high-speed and miniaturized electronics, understanding the PCB manufacturing process can help PCB design engineers create successful, cost-effective designs using advanced technologies. Designs that incorporate blind and buried vias, boards with space constraints, sensitive signal integrity requirements, or internal heat dissipation concerns are often candidates for HDI technology and usually require sequential lamination to satisfy the requirements.
OKI Launches Rigid-Flex PCBs with Embedded Copper Coins Featuring Improved Heat Dissipation for Space Equipment Applications
07/29/2025 | BUSINESS WIREOKI Circuit Technology, the OKI Group’s printed circuit board (PCB) business company, has developed rigid-flex PCBs with embedded copper coins that offer improved heat dissipation for use in rockets and satellite-mounted equipment operating in vacuum environments.