-
-
News
News Highlights
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
AT&S Reports Milestones, Records in the Construction of New Microelectronics Centers
June 1, 2023 | AT&SEstimated reading time: 3 minutes

The big construction cranes in Leoben Hinterberg have disappeared and the view is unobstructed again. It is now easy to see which milestones and records AT&S has achieved within a very short period of time – not just at the headquarters in Leoben. The research and development center with its series production for IC substrate technology is in itself a lighthouse project.
“Setting up this technology outside of Asia and bringing an IC substrate production facility of this dimension to the western world for the first time is a one-of-a kind project in and for Europe,” says project leader Nikolaus Bauer-Oeppinger and adds: “We are on schedule with the construction site and alongside the final exterior work, we started to move in the first production machines in April. Now there is nothing in the way of starting the qualification in the near future so that we can broaden our customer portfolio and supply our customers even faster and better.”
The building envelope of the future R&D and IC substrate center, which will open as plant 3 alongside the two existing production facilities in Leoben Hinterberg, was put up in a record time of only 14 months. A mighty bridge made of glass and steel connects the new competence center with the existing plants.
Largest construction site in Styria
The figures associated with the 500-million-euro project are impressive and make it the largest construction site in Styria: at the peak of the activities in March and April, 1,100 people were working on the building site and the delivery of machines. 11,000 sqm of clean room production area were established and the gross floor area amounts to 39,000 sqm – that equals six soccer fields for microelectronics. 80,000 tons of concrete and 4,700 tons of steel were used. Enough cables were laid to span the distance from Leoben to Zagreb (270 km). Especially IC substrates – which are essential for the leading-edge applications in microelectronics – will be produced in Leoben from 2024 onwards: that is a first for Europe. AT&S thus underlines its role as an innovation driver and technology pioneer.
New machines of a completely different dimension will be used for this purpose: the special machinery and equipment required for the product miniaturization of future IC substrates allow us to advance to (printed circuit board) substrate structures 10 times thinner than a human hair.
Two and a half Eiffel Towers in Kulim
Another two key milestones have been achieved at the even bigger AT&S Kulim site as the key executives of AT&S from Austria and Malaysia celebrated the roof closing of its first production plant and the installation of first set of tools. Production will start in autumn 2024. The second production plant has been paused at the status wind and water tight. The ramp-up depends on how the market develops.
At AT&S Kulim site, there are approximately 5,000 construction workers performing different construction tasks at site to deliver the fast track construction progress. Here, the figures are extremely impressive, too: The Kulim project will have a clean room area of 120,000 sqm – this corresponds to an incredible size of 17 soccer fields. The 24,000 tons of steel would be enough to build 2.5 Eiffel Towers.
AT&S’s Microelectronics Business Unit Executive Vice President Ingolf Schröder, comments: “I am tremendously delighted by the achievement of these two key milestones within 15 months after we broke the ground. They are victoriously accomplished after overcoming enormous health (pandemic), resources and logistical challenges.” AT&S’s Malaysia Managing Director Vittorio Villari, says: “The set-up of such a big plant has been achieved thanks to a pool of experienced talents and a matured electrical and electronics eco-system. AT&S collaborates with multinational corporations operating for more than 50 years in Malaysia, coupled with AT&S proprietary leading-edge high-end IC substrates technology.”
With the Austrian-based new production and research center of competence at the headquarters in Leoben, the new plant in Kulim and the strong and established production sites in Chongqing, Shanghai (both China), Ansan (Korea) and Nanjangud (India) AT&S is convinced to be ahead of the game. With cutting-edge technology, quality and excellence in PCBs and IC substrates AT&S is part of the solution for the future.
Suggested Items
Kitron Receives EUR 4 Million Contract for Defense Airborne Radar Application
07/02/2025 | KitronKitron has received an order valued at EUR 4 million to produce electronics modules for airborne radar application, destined for the US market.
Toni Patzner Becomes Global Head of Supply Chain Management at ASMPT SMT Solutions
07/01/2025 | ASMPTOn June 1, 2025, Toni Patzner assumed the position of Global Head of Supply Chain Management. The experienced manager succeeded Jörg Cwojdzinski, who retired after decades of service.
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Specially Developed for Laser Plastic Welding from LPKF
06/25/2025 | LPKFLPKF introduces TherMoPro, a thermographic analysis system specifically developed for laser plastic welding that transforms thermal data into concrete actionable insights. Through automated capture, evaluation, and interpretation of surface temperature patterns immediately after welding, the system provides unprecedented process transparency that correlates with product joining quality and long-term product stability.
Excellon Installs COBRA Hybrid Laser at Innovative Circuits
06/23/2025 | ExcellonExcellon is pleased to announce the successful installation of a second COBRA Hybrid Laser System at Innovative Circuits, located in Alpharetta, Georgia. The Excellon COBRA Hybrid Laser System uniquely combines both UV and CO₂ (IR) laser sources on a single platform—making it ideal for high-density prototype and production printed circuit boards (PCBs).