IDC MarketScape Names Siemens a Manufacturing Execution System Leader for 2023
June 2, 2023 | SiemensEstimated reading time: 1 minute
Siemens Digital Industries Software announced it has been named a Leader in five IDC MarketScape reports focused on Manufacturing Execution Systems (MES) software and its associated markets and industry adoption. The IDC MarketScape reports assess software providers in the MES market: Worldwide High-Tech and Electronics Manufacturing Execution Systems1, Worldwide Engineering Intensive Manufacturing Execution Systems2, Worldwide Discrete Manufacturing Execution Systems3, Worldwide Process Manufacturing Execution Systems4, and Asia/Pacific Manufacturing Execution Systems5. Siemens is the only vendor to be named as a Leader in all 5 reports.
“We are delighted that IDC MarketScape has recognized Siemens as a Leader in MES and the work we have been doing to bring advanced, integrated Manufacturing Execution Systems technology to our customers across the globe,” said Tobias Lange, Senior Vice President Manufacturing Operations Management, Digital Manufacturing, Siemens Digital Industries Software. “Not only are we committed to providing advanced technologies, but our drive to make these systems readily configurable, easily deployable and flexibly scalable is, we believe, paying dividends for our customers in every industry we serve.”
This follows the recent news that Siemens has been positioned in the Leaders Quadrant of the Gartner Magic Quadrant for Manufacturing Execution Systems (MES) for the sixth consecutive time.
Opcenter Execution software helps customers to optimize manufacturing operations, accurately reflecting design, engineering and process data in the production of actual finished products. The software helps customers to deliver a comprehensive digital twin to the factory floor, accelerating production by digitally linking enterprise systems with automated manufacturing equipment. Opcenter is part of the Siemens Xcelerator portfolio and a key pillar of the recently announced Industrial Operations X solution for automating and operating industrial production.
Suggested Items
PCB Design Software Market Expected to Hit $9.2B by 2031
11/21/2024 | openPRThis report provides an overview of the PCB design software market, detailing key market drivers, challenges, technological advancements, regional dynamics, and future trends. With a projected compound annual growth rate (CAGR) of 13.4% from 2024 to 2031, the market is expected to grow from USD 3.9 billion in 2024 to USD 9.2 billion by 2031.
SIA Applauds CHIPS Award for Semiconductor Research Corporation’s SMART USA Institute
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the announcement that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) are entering negotiations for the Commerce Department to provide SRC $285 million to establish and operate the CHIPS Manufacturing USA Institute for Digital Twins.
SIA Praises Finalization of CHIPS Investments for GlobalFoundries Manufacturing Projects
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding finalization of semiconductor manufacturing investments announced by the U.S. Department of Commerce and GlobalFoundries.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.