Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 4

10/03/2024 |
Chapter 4 of this book addresses the challenges in ensuring high electrical reliability of low-temperature solder pastes in modern electronic assembly. Also covered is the need for new-generation materials due to advancements in technology. The authors also explore the impact of flux components on electrical reliability and the formulation considerations to achieve higher reliability.

AIM to Present on Ultra-Miniature Component Assembly at SMT-Info

10/02/2024 | AIM
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMT-Info Technical Conference taking place October 15-16 in Brno, Czech Republic.

Mycronic’s Jet Set Technology

10/02/2024 | Nolan Johnson, SMT007 Magazine
In this interview, Wolfgang Heinecke, head of global product management at Mycronic, discusses advancements and applications of jet printing technology, which offers solutions to the challenges faced by traditional stencil printing. He highlights the key benefits of jet printing, and explains the qualification process for solder paste compatibility as well as the software-driven nature of jet printing, which allows for quick program creation and real-time adjustments.

Metcal Introduces New MicroFine Products for Soldering Under the Microscope

10/02/2024 | Metcal
Metcal, part of OK International and Dover and a leader in benchtop soldering for electronics and industrial manufacturing, announced the launch of its new MicroFine soldering handpieces and cartridge tips for use under microscopes.

Indium to Showcase Industry-Leading Solder Paste and Alloy Technology at Detroit Battery Show

10/01/2024 | Indium Corporation
As one of the leading materials providers to the electronics assembly industry, Indium Corporation® is proud to feature its industry-leading Durafuse® solder technology at the Battery Show North America, October 7-10, in Detroit, Michigan.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in