Metcal Introduces CV-IOT Gateway Module and Desktop Application
June 5, 2023 | MetcalEstimated reading time: 1 minute
METCAL, a leader in benchtop soldering systems, announces the release of their new CV-IOT Gateway Module and desktop application which enables operations management to collect advanced soldering data from every benchtop station on their network.
By connecting the CV-IOT gateway to a Metcal Connection Validation (CV) soldering system and a computer or network, operations can utilize information on every joint to improve process control and efficiency in the soldering process. A standard handheld barcode scanner can easily be added to the setup for board-level traceability.
Using the desktop application, managers can easily analyze the data collected by the system to evaluate operator efficiency, quality of solder joints, temperature and power profiles, and even the cartridges used (including geometries, part numbers, serial numbers, and lot codes) for each soldering process. Alerts can also be set up to notify managers in real-time when processes are not being followed or when there is a concern with a soldering station.
The information from each solder event is stored using a standard database structure, ensuring the data is compatible with standard database applications and is easily accessible by the software application.
To ensure data security, the CV-IOT module plugs directly into the CV unit and the computer or network only through a wired connection.
The CV-IOT is expected to be particularly crucial for manufacturers where maximizing process control and traceability is essential.
“CV-IOT makes real-time process control and traceability simple,” said Seerena Wright, Metcal Product Manager. “CV-IOT allows users to quickly see what is happening throughout their operation, and to easily spot spikes or dips in throughput, identify potential problems, and trace the source of solder joint faults.”
CV-IOT is compatible with all Metcal Connection Validation™ soldering systems. The CV-IOT desktop application requires Windows 10, Intel® Core™ i5 CPU or better, 2 GB of RAM, Intel® HD Graphics, at least 150 GB of storage, and Ethernet 10/100.
Suggested Items
Dr. Jennie Hwang to Deliver Two PDCs at IPC APEX EXPO
02/04/2025 | Dr. Jennie HwangDr. Jennie Hwang, chair of the AI Committee of National Academies/DoD AI study, Chair of National AI Institute of NSF, and Committee of Strategic Thinking for Engineering Research in the Era of Artificial Intelligence of NSF, brings broad-based information and insights through an integrated perspective to the AI course.
TopLine Bringing Answers, New Ideas to APEX 2025
02/04/2025 | TopLineTopLine® Corporation’s engineers will discuss groundbreaking technologies and product solutions at the upcoming IPC APEX EXPO 2025 this coming March 18-20 at the Anaheim Convention Center in California.
Solderstar to Present Advanced Profiling Solutions at IPC APEX EXPO 2025
02/04/2025 | SolderStarSolderstar, a leading provider of profiling solutions for the electronics manufacturing industry, will exhibit at IPC APEX EXPO 2025, which will take place March 18-20, 2025, at the Anaheim Convention Center in California.
Rehm Thermal Systems: Future Technologies for Coating, Dispensing and Vapour Phase Soldering Live at IPC APEX EXPO 2025
02/04/2025 | Rehm Thermal SystemsIPC APEX EXPO 2024, which takes place from 18 to 20 March at the Anaheim Convention Center in California, is the largest and most important trade fair for electronics manufacturing in North America.
YINCAE Launches UF 120LA
02/04/2025 | YINCAEYINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With exceptional flowability into 20μ gaps, UF 120LA eliminates cleaning processes, reducing costs and environmental impact while ensuring superior performance across applications like BGA, flip chip, WLCSP, and multi-chip modules.