IPC, TEEMA Sign MoU to Support the Electronics Manufacturing Industry’s Digital Transformation

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On May 17, 2023, IPC and Taiwan Electrical and Electronic Manufacturers’ Association (TEEMA) signed a Memorandum of Understanding (MoU) at the Electrical Wire Processing Technology Expo (EWPTE) in Milwaukee, Wis., USA. The MoU aims to promote the adoption and use of IPC-2591, Connected Factory Exchange, the plug-and-play industry standard for factory communication which sets the baseline for companies to achieve Industry 4.0.

The MoU marks the two organizations’ joint efforts and commitment in promoting the digital transformation of the electronics manufacturing industry. Through cooperation, IPC and TEEMA have agreed to promote global acceptance and adoption of IPC’s international standards, raise the industry's awareness of IPC-2591, and encourage enterprises to accelerate the pace of digital transformation to adapt to changing market demands and technology development.

“IPC and TEEMA share a mutual goal of supporting the electronics industry’s digital transformation,” said IPC President and CEO John W. Mitchell. “TEEMA has played a very important role in promoting the implementation of the IPC CFX standard. We firmly believe that the partnership between IPC and TEEMA and our joint efforts to promote the electronics industry’s digital transformation will certainly propel industry through the next industrial revolution.”

Added Sydney Xiao, president, IPC Asia, “I am confident that the strength of our partnership and commitment to serve the needs of our members will be the cornerstone of IPC and TEEMA’s cooperative efforts. We look forward to actively driving the digital transformation of the industry, which in turn drives the competitive excellence and financial success of our member companies.”