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Connect the Dots: Designing for Reality—Lamination and Materials

06/19/2024 | Matt Stevenson -- Column: Connect the Dots
As many of you have likely figured out, I am quite passionate about the subject of designing PCBs for the reality of manufacturing. I wrote a book about it and I participate in an I-Connect007 On the Line with… podcast series dedicated to the subject. This companion article will focus on multilayer lamination, keeping the bigger picture in mind: Realistic PCB designs should prioritize manufacturability and reliability of the PCB as well as meet the other design requirements. So, one must account for the production variables associated with individual manufacturing partners.

Day 2: A Full Day at the EIPC Summer Conference

06/19/2024 | Pete Starkey, I-Connect007
Editor's note: This is the third and final report from the EIPC Summer Conference. It was a bright and early start to the second day of the 2024 EIPC Summer Conference at the European Space Centre, Noordwijk, The Netherlands, June 4-5. A short journey by bus from the hotel in Leiden and our security passes from the day before got us through the gate and to our seats in the Newton Room for Session 4, “Material Studies,” moderated by Martyn Gaudion. 

Looking Into Space: EIPC Summer Conference, Part 2

06/17/2024 | Pete Starkey, I-Connect007
“Innovative Development of PCB Technology and Design” was the theme of the second session of the 2024 EIPC Summer Conference, June 4-5, at the European Space Centre, Noordwijk, The Netherlands.

TopLine Introduces Braided Columns as Drop-in Replacement for BGA Solder Balls

06/17/2024 | TopLine

The Pulse: Overconstraining: Short, Slim, and Smooth

06/06/2024 | Martyn Gaudion -- Column: The Pulse
Engineering is both an art and a science. The design engineer’s task is (almost) always to bring product to market that meets specifications at the best and most economical price suited to the appropriate end use requirements. From a PCB perspective, designers are faced with a bewildering and almost overwhelming choice of materials at their disposal.
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