-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
EIPC Summer Conference 2023: Day 1 Review
June 28, 2023 | Pete Starkey, I-Connect007Estimated reading time: 14 minutes
Automotive Radar Applications
The development of a stable dielectric performance and low modulus copper-clad laminate for automotive radar applications was described by Yonghyon Kim, senior engineer with Doosan Corporation Electro-materials.
He reviewed the technological trend for radar sensors and the laminate requirements for automotive radar operating at 77–79 GHz frequencies. To minimise mechanical stress, a low-modulus material is necessary, and he described a filled fluoroplastic material without woven glass reinforcement. This gives advantages in mechanical drilling together with dielectric uniformity and CAF-resistance as well as outstanding high-frequency performance, making it an excellent choice for automotive radar applications.
Kim gave a comprehensive list of material properties and examples of reliability test results, particularly heat aging and thermal cycling.
He concluded by demonstrating that the mega-trend toward smart mobility will necessitate hyper-connectivity and convergence in a whole series of industries, and described the range of copper-clad laminate material solutions offered by Doosan.
Conclusion
At the end of the day’s conference proceedings, we took a short bus journey to BMW World, where we saw many shiny motor cars, BMW, Mini, and Rolls Royce, and some desirable motorcycles, as well as learning about thousand-dollar umbrellas and hand-painted coach-lines.
In the evening, we took the bus downtown to a traditional Bavarian restaurant overlooking the opera house Spatenhaus an der Oper, for a splendid networking dinner.
Note: My thanks to Alun Morgan for the excellent photographs.
Links to other articles in this three-part series:
Page 3 of 3
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Closing the Loop on PCB Etching Waste
09/09/2025 | Shawn Stone, IECAs the PCB industry continues its push toward greener, more cost-efficient operations, Sigma Engineering’s Mecer System offers a comprehensive solution to two of the industry’s most persistent pain points: etchant consumption and rinse water waste. Designed as a modular, fully automated platform, the Mecer System regenerates spent copper etchants—both alkaline and acidic—and simultaneously recycles rinse water, transforming a traditionally linear chemical process into a closed-loop system.
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
09/08/2025 | Kurt Palmer -- Column: Driving InnovationIn PCB manufacturing, the demand for increasingly complex and miniaturized designs continually pushes the boundaries of traditional fabrication methods, including depth routing. Success in these applications demands not only on robust machinery but also sophisticated control functions. PCB manufacturers rely on advanced machine features and process methodologies to meet their precise depth routing goals. Here, I’ll explore some crucial functions that empower manufacturers to master complex depth routing challenges.
Trouble in Your Tank: Minimizing Small-via Defects for High-reliability PCBs
08/27/2025 | Michael Carano -- Column: Trouble in Your TankTo quote the comedian Stephen Wright, “If at first you don’t succeed, then skydiving is not for you.” That can be the battle cry when you find that only small-diameter vias are exhibiting voids. Why are small holes more prone to voids than larger vias when processed through electroless copper? There are several reasons.
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
08/25/2025 | Chris Mitchell -- Column: The Government CircuitAs global trade winds continue to howl, the electronics manufacturing industry finds itself at a critical juncture. After months of warnings, the U.S. Government has implemented a broad array of tariff increases, with fresh duties hitting copper-based products, semiconductors, and imports from many nations. On the positive side, tentative trade agreements with Europe, China, Japan, and other nations are providing at least some clarity and counterbalance.
How Good Design Enables Sustainable PCBs
08/21/2025 | Gerry Partida, Summit InterconnectSustainability has become a key focus for PCB companies seeking to reduce waste, conserve energy, and optimize resources. While many discussions on sustainability center around materials or energy-efficient processes, PCB design is an often overlooked factor that lies at the heart of manufacturing. Good design practices, especially those based on established IPC standards, play a central role in enabling sustainable PCB production. By ensuring designs are manufacturable and reliable, engineers can significantly reduce the environmental impact of their products.