SHENMAO Offers Halogen-Free SM-862 Liquid Flux as a Replacement for SM-816
July 13, 2023 | SHENMAO America, Inc.Estimated reading time: 1 minute

SHENMAO America, Inc. is pleased to announce the availability of its halogen-free SM-862 Liquid Flux, designed to replace the widely used halogenated SM-816. The SM-862 Flux offers a range of benefits, including low solid content and smooth residue, making it an excellent choice for automatic wave soldering and manual dipping processes.
SM-862 is a rosin-containing flux specifically formulated to leave minimal residue and reduce the occurrence of bridges during soldering. This halogen-free ROL0 (J-STD-004B) flux is tack-free and no-clean, suitable for various automated and selective soldering applications. It exhibits exceptional hole-fill ability and effectively prevents bridges when soldering high-density components on circuit boards.
The versatility of SM-862 makes it ideal for applications such as wave soldering, selective soldering and dipping. It is well-suited for use in industrial PC (IPC), motherboards, power boards, server boards, and other components requiring dipping. The flux delivers excellent solderability and leaves behind a flux residue that exhibits high voltage endurance.
SHENMAO has received approval from numerous internationally renowned electronic manufacturers, affirming the quality and reliability of their products. The company's commitment to delivering the highest standards without compromising on cost and time-to-market ensures maximum value for its customers. SHENMAO America, Inc. manufactures SMT solder paste at its San Jose, CA facility for distribution throughout North America.
"We are excited to introduce the halogen-free SM-862 Liquid Flux as an alternative to the widely used SM-816," said Watson Tseng, General Manager at SHENMAO America, Inc. "With its low solid content, smooth residue, and excellent solderability, SM-862 provides our customers with a reliable solution for their soldering needs. We are dedicated to offering top-quality products that meet the highest industry standards."
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.