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Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
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DuPont Appoints Avi Avula as Vice President of Strategy, Electronics & Industrial
August 10, 2023 | DuPontEstimated reading time: 2 minutes

Avi is the Vice President of Strategy for DuPont Electronics & Industrial (E&I) with additional responsibility for sustainability and business excellence.
Before his current role, Avi was the Global Vice President & General Manager for Interconnect Solutions (ICS), a line of business within DuPont E&I focused on delivering total solutions and systems design to address signal integrity and power transmission challenges, while taking care of our people and our planet. During his tenure in ICS, Avi led the integration of DuPont Circuit and Packaging Materials (CPM) and Dow Interconnect Technologies during the merger between Dow and DuPont. Avi also led the $2.3 billion Laird Performance Materials acquisition, successfully integrated Laird, and tripled ICS’ revenue to $1.8 billion. He initiated the People CARE culture to foster an authentic and transparent environment that consistently helps the ICS team and organization to thrive. He also set the sustainability aspiration “zero by 2030” as part of the ICS business strategies. Avi also made an impact around the world, including setting up E&I’s regional headquarters in Singapore and acting as Singapore country leader. Previously in DuPont, Avi served as the Global Business Director for Displays, where he led the OLED and flexible display business.
Prior to DuPont, Avi held numerous roles with Applied Materials, most recently in Singapore where he led their business and technology development for advanced packaging. While in this role, Avi established a partnership with A-STAR’s Institute of Microelectronics to build a $100 million R&D center. Avi’s earlier roles at Applied Materials’ headquarters in Santa Clara, included serving as Assistant to the Chairman and CEO on strategic, operational and governance matters. Earlier, in his corporate strategy role, Avi was involved in enabling the company to grow into the photovoltaic market by crafting business strategy and helping to acquire and integrate two European PV equipment makers. He also provided strategic support for the core semiconductor businesses and led initiatives that helped to turnaround a business segment to regain market leadership.
Avi’s additional experience includes serving as a management consultant at Booz & Co. where he worked on business, operations and product strategies across the automotive, pharmaceuticals and consumer products sectors in the US and Europe. He has also worked extensively in the semiconductor fabrication, electronics packaging and assembly industries in the US and Asia.
Avi has an MBA from the University of Chicago, and an MS in Industrial Engineering from Texas A&M University. He earned his bachelor’s degree in Mechanical Engineering, specializing in composite materials in India. Avi has served in advisory roles at the National University of Singapore, and to the MBA program at the University of Chicago. Avi was recognized by the Taiwan Printed Circuit Association (TPCA) in 2022, with the International Outstanding Contribution Award for his contributions to the acceleration of the development of the PCB industry in Taiwan. He is also listed as co-inventor on 2 patent filings. Avi is currently based in Sunnyvale, California.
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September PCB007 Magazine: The Future of Advanced Materials
09/16/2025 | I-Connect007 Editorial TeamMoore’s Law is no more, and the advanced material solutions being developed to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
Panasonic Industry will Double the Production Capacity of MEGTRON Multi-layer Circuit Board Materials Over the Next Five Years
09/15/2025 | Panasonic Industry Co., Ltd.Panasonic Industry Co., Ltd., a Panasonic Group company, announced plans for a major expansion of its global production capacity for MEGTRON multi-layer circuit board materials today. The company plans to double its production over the next five years to meet growing demand in the AI server and ICT infrastructure markets.
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
09/15/2025 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite are gaining popularity throughout the world. The environmental and productivity gains achievable with this process are outstanding. Direct metallization reduces the costs of compliance, waste treatment, and legal issues related to chemical exposure. A graphite-based direct plate system has been devised to address these needs.
Fresh PCB Concepts: Designing for Success at the Rigid-flex Transition Area
08/28/2025 | Team NCAB -- Column: Fresh PCB ConceptsRigid-flex PCBs come in all shapes and sizes. Manufacturers typically use fire-retardant, grade 4 (FR-4) materials in the rigid section and flexible polyimide materials in the flex region. Because of the small size, some rigid-flex PCBs, like those for hearing aid devices, are among the most challenging to manufacture. However, regardless of its size, we should not neglect the transition area between the rigid and flexible material.