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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Indium Promotes Chris Bastecki to Business Unit Vice President

09/11/2026 | Indium Corporation
Indium Corporation is pleased to announce the promotion of Chris Bastecki to Business Unit Vice President, Americas Sales & Service and Global Printed Circuit Board (PCB) Assembly Materials Marketing.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

09/11/2026 | Marcy LaRont, I-Connect007
I feel compelled to start off by recognizing that today marks the 25th anniversary of the tragic activities that took place on 9/11/2001. Like so many of us, I will never forget exactly where I was and what I was doing when I heard that United flights 11 and 175 had struck the World Trade Center in NYC. That day, the world was forever changed, and the effects still reverberate. Today, I am taking a moment to remember the lives lost and the heroism and coming together that day brought about. 

MacDermid Alpha Addresses Growing Demands for Electronics Reliability and Manufacturing Performance at Productronica India 2026

09/10/2026 | MacDermid Alpha
MacDermid Alpha Electronics Solutions will highlight advanced materials engineered to improve reliability, process consistency and performance in increasingly complex electronics applications at Productronica India 2026, September 16-18, at the Bangalore International Exhibition Centre in Bengaluru.

I-Connect007 Launches New Qnity Podcast Series, ‘Engineering What’s Next’

09/10/2026 | I-Connect007
I-Connect007 is pleased to announce the launch of On the Line With… Qnity: Engineering What’s Next, a new six-part podcast series exploring the materials science and engineering innovations shaping the next generation of electronics. The inaugural episode, “Inside Qnity’s Materials Science Legacy,” features Jake Joo, global technology director for Advanced Flex Technologies. In conversation with host Marcy LaRont, Joo discusses Qnity’s heritage, the evolution of its Advanced Flex Technologies business, and the history behind well-known material platforms such as Kapton® polyimide films and Pyralux® flex circuit laminates and adhesive systems.

Built Here, and Ready for What’s Next

09/08/2026 | Laura Martin, Isola
The rise of drones is no longer on the horizon. Unmanned systems have rapidly changed the modern battlefield, demonstrating the value of platforms that can sense, communicate, process information, and act at unprecedented speed. But as development and production of these systems accelerate, another mission-critical consideration is coming into focus: the supply chain behind the electronics. U.S. defense policy is focusing on reducing dependence on covered foreign sources for unmanned systems and their critical components. The message to the defense industrial base is becoming clear: Resilient, trusted supply chains matter, and the electronics inside tomorrow's unmanned platforms are part of that equation.
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