Nokia Expands Manufacturing in U.S.
August 21, 2023 | NokiaEstimated reading time: 2 minutes

Nokia has announced that it is the first telecom vendor to manufacture fiber broadband optical modules in the U.S. for use in the Broadband Equity, Access and Deployment (BEAD) program. Partnering with Fabrinet, a global manufacturer of highly precise optical products, Nokia will produce multi-rate optical modules at Fabrinet’s state-of-the-art facility in Santa Clara, California. Production will start in 2024 and brings additional high-tech jobs to the country. The announcement builds on Nokia’s previous decision to produce fiber-optic broadband network electronic products in Kenosha, Wisconsin.
Optical modules are a key high-tech component of fiber broadband networks. They convert electrical signals into light and vice versa, and are essential for connecting homes to high speed, multi-gigabit broadband. By manufacturing these optical modules in the U.S., Nokia continues to expand its list of products and solutions for networks rollouts using BEAD or other funding. States and infrastructure players seeking to participate in BEAD and the $42.45bn of available funding allocated for broadband rollouts to unserved and underserved communities are required to use equipment manufactured in the U.S..
Operators seeking to leverage BEAD funding to bridge the digital divide now have access to the latest cutting-edge technology for their deployments. Today, more than 70 percent of fiber broadband lines in North America are powered by Nokia. Using multi-rate optical modules and products allows operators to easily upgrade speeds from 1 Gig to Multi-Gig. Combined with Nokia’s award-winning 25G solutions and research into 100G technology, this ensures that operators are building fiber networks that will meet user requirements for generations to come.
Sandy Motley, President of Fixed Networks at Nokia, said: “Many in the industry have said that manufacturing optical modules in the U.S. was impossible. Today, we’re proving it can be done. Working alongside the Department of Commerce and Fabrinet, we’re excited to add optical modules to the list of technology solutions that will be produced here in the U.S. and become available to programs like BEAD which are so critical to bridging the digital divide.”
Harpal Gill, President and COO of Fabrinet, said: “Fabrinet specializes in manufacturing complex, precision optical and electro-optical products used in telecommunications networks and data centers. As a trusted partner of the world’s most demanding OEMs, we are excited to help bring the production of Nokia’s optical modules to the U.S. and support their efforts to bridge the digital divide. We’re pleased to partner with Nokia in order to help provide high-speed fiber broadband access to more people, homes and communities.”
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Blaize, Technology Control Company Partner to Power Saudi Arabia’s Next-Generation AI Innovation Infrastructure
09/17/2025 | BUSINESS WIREBlaize Holdings, Inc., a leader in programmable, energy-efficient edge AI computing, and Technology Control Company (TCC), a leading technology solutions provider in the Kingdom of Saudi Arabia (KSA), announced a strategic partnership to advance Saudi Arabia’s AI innovation infrastructure and accelerate its digital transformation goals.
BLT Joins Microchip Partner Program as Design Partner
09/17/2025 | BUSINESS WIREBLT, a U.S.-owned and operated engineering design services firm announced it has joined the Microchip Design Partner Program.
Curing and Verification in PCB Shadow Areas
09/17/2025 | Doug Katze, DymaxDesign engineers know a simple truth that often complicates electronics manufacturing: Light doesn’t go around corners. In densely populated PCBs, adhesives and coatings often fail to fully cure in shadowed regions created by tall ICs, connectors, relays, and tight housings.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
Altair, Wichita State University’s NIAR Sign MoU to Accelerate Aerospace Innovation
09/16/2025 | AltairAltair, a global leader in computational intelligence, and Wichita State University’s (WSU) National Institute for Aviation Research (NIAR), one of the world’s leading aerospace research institutions, have signed a memorandum of understanding (MoU) to advance innovation across the aerospace and defense industries.