Nokia Expands Manufacturing in U.S.
August 21, 2023 | NokiaEstimated reading time: 2 minutes
Nokia has announced that it is the first telecom vendor to manufacture fiber broadband optical modules in the U.S. for use in the Broadband Equity, Access and Deployment (BEAD) program. Partnering with Fabrinet, a global manufacturer of highly precise optical products, Nokia will produce multi-rate optical modules at Fabrinet’s state-of-the-art facility in Santa Clara, California. Production will start in 2024 and brings additional high-tech jobs to the country. The announcement builds on Nokia’s previous decision to produce fiber-optic broadband network electronic products in Kenosha, Wisconsin.
Optical modules are a key high-tech component of fiber broadband networks. They convert electrical signals into light and vice versa, and are essential for connecting homes to high speed, multi-gigabit broadband. By manufacturing these optical modules in the U.S., Nokia continues to expand its list of products and solutions for networks rollouts using BEAD or other funding. States and infrastructure players seeking to participate in BEAD and the $42.45bn of available funding allocated for broadband rollouts to unserved and underserved communities are required to use equipment manufactured in the U.S..
Operators seeking to leverage BEAD funding to bridge the digital divide now have access to the latest cutting-edge technology for their deployments. Today, more than 70 percent of fiber broadband lines in North America are powered by Nokia. Using multi-rate optical modules and products allows operators to easily upgrade speeds from 1 Gig to Multi-Gig. Combined with Nokia’s award-winning 25G solutions and research into 100G technology, this ensures that operators are building fiber networks that will meet user requirements for generations to come.
Sandy Motley, President of Fixed Networks at Nokia, said: “Many in the industry have said that manufacturing optical modules in the U.S. was impossible. Today, we’re proving it can be done. Working alongside the Department of Commerce and Fabrinet, we’re excited to add optical modules to the list of technology solutions that will be produced here in the U.S. and become available to programs like BEAD which are so critical to bridging the digital divide.”
Harpal Gill, President and COO of Fabrinet, said: “Fabrinet specializes in manufacturing complex, precision optical and electro-optical products used in telecommunications networks and data centers. As a trusted partner of the world’s most demanding OEMs, we are excited to help bring the production of Nokia’s optical modules to the U.S. and support their efforts to bridge the digital divide. We’re pleased to partner with Nokia in order to help provide high-speed fiber broadband access to more people, homes and communities.”
Suggested Items
Betamek Achieves Top Level 5 in MaRii’s Supplier Competitiveness Assessment
01/21/2025 | BetamekBetamek Berhad, an original design manufacturer (ODM) and a leading player in electronics manufacturing services (EMS) for the automotive industry, proudly announces that its wholly-owned subsidiary, Betamek Electronics (M) Sdn. Bhd. (Betamek Electronics), has achieved Level 5.
NovoLINC Secures Investments to Assist AI Computing with Groundbreaking Thermal Interface Technology
01/21/2025 | PRNewswireNovoLINC, a thermal technology startup spun out of Carnegie Mellon University, announced seed funding led by M Ventures, with participation from Foothill Ventures and TDK Ventures. NovoLINC's breakthrough nanocomposite thermal solutions reduce thermal resistance to an industry-record low (< 1mm²-K/W), according to company co-founders, CSO Prof. Sheng Shen and CTO Dr. Rui Cheng.
U.S. Department of Commerce Announces CHIPS Incentives Awards with Corning, Edwards Vacuum, and Infinera
01/21/2025 | U.S. Department of CommerceThe U.S. Department of Commerce announced it finalized three separate awards under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
Beyond Design: Electro-optical Circuit Boards
01/22/2025 | Barry Olney -- Column: Beyond DesignPredicting the role of PCB designers in 10 years is a challenge. If only I had a crystal ball. However, we know that as technology progresses, the limitations of copper PCBs are increasingly apparent, particularly regarding speed, bandwidth, and signal integrity. Innovations such as optical interconnects and photonic integrated circuits are setting the stage for the next generation of PCBs, delivering higher performance and efficiency. The future of PCB design will probably incorporate these new technologies to address the challenges of traditional copper-based designs.
The Pulse: Ultra Upgrade Unknowns—What’s Coming for UHDI?
01/21/2025 | Martyn Gaudion -- Column: The PulseAs we enter the second quarter of the 21st century, there appears to be a new chapter in PCB technology. Ultra high density interconnect (UHDI) has become a buzzword, but it’s actually not that new; many of the processes were already established in the high-volume production of Asian cell phones and tablets. What is new and challenging, however, is migrating the line widths and stackups—once the domain of handheld consumer products—into the lower volume specialized environment of the commercial world.