Atotech to Participate at KPCA Show 2023 in Seoul, South Korea
August 28, 2023 | AtotechEstimated reading time: 1 minute

MKS’ Atotech will participate at this year’s KPCA Show 2023 in Seoul, South Korea, which will be held at Incheon Songdo Convensia from September 6-8, 2023. MKS will represent its strategic brands, Atotech® and ESI®, and will introduce its latest products and solutions for PCB and package substrate manufacturing, ranging from chemical processes, production systems, auxiliary equipment, and lasers to software solutions for optimized production yield, reliability and efficiency.
All visitors are encouraged to stop by booth G201 and learn about the new solutions:
- G-Plate®: New vertical desmear and electroless HVM plating tool for next-generation high-end package substrates with well-organized particle control
- Geode® A: New CO2 laser system for high precision and high-speed ABF build-up laminate processing
- Printoganth® MV TP3: Ultra-thin electroless copper for advanced SAP manufacturing
- InPro® Pulse TVF: New vertical production solution for high aspect ratio through hole filling with best reliability
- EcoFlash® S300: Differential etching for advanced SAP manufacturing
- Stannatech® 2000: The leading immersion tin process designed to meet future requirements
MKS is highly committed to driving next generation package substrate development working towards meeting 5/5µm L/S targets. By combining leading capabilities in lasers, optics, motion, process chemistry and equipment (horizontal and vertical), we are positioned to Optimize the Interconnect(SM), a significant enabling point of next-generation advanced electronics that represents the next frontier for miniaturization and complexity.
Gucheol Kim, marketing manager of Atotech Korea, said, “Printed circuit boards, package substrates and semiconductor are all key enabler for a modern world and will continue to play an important role as we further progress our journey advancing technical capabilities and with-it electronic products. Today, these mission critical electronic products use components that make innovation possible in various ends, be it 5/6G networks, high-performance computing for server/data centers, self-driving or electric cars, and many more. The requirements for ultra-small, thin, flexible, and high-performing electrical components and the need to provide more sustainable solutions is what keeps us innovating. We understand and strive to satisfy the diverse needs of our customers.”
Conference: KPCA Show 2023
Date: September 6-8, 2023
Booth: G201
Venue: Incheon Songdo Convensia
Suggested Items
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
05/09/2025 | Michael Carano -- Column: Trouble in Your TankIn the business of printed circuit fabrication, yield-reducing and costly defects can easily catch even the most seasoned engineers and production personnel off guard. In this month’s column, I’ll investigate copper plating voids with their genesis in the pre-plating process steps.
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
04/15/2025 | Michael Carano -- Column: Trouble in Your TankThere are numerous factors at play in the science of electroplating or, as most often called, electrolytic plating. One critical element is the use of organic addition agents and their role in copper plating. The function and use of these chemical compounds will be explored in more detail.
IDTechEx Highlights Recyclable Materials for PCBs
04/10/2025 | IDTechExConventional printed circuit board (PCB) manufacturing is wasteful, harmful to the environment and energy intensive. This can be mitigated by the implementation of new recyclable materials and technologies, which have the potential to revolutionize electronics manufacturing.